Conference Plenary Speakers (2025)
           
Heterogeneous Computing Solutions for Power-Performance Efficient On-Device AI
Dr. Giri Nallapati, Vice President of Technology, Qualcomm Inc., USA
 
From the Nanometer Scale to Light Years
Dr. Edmundo A. Gutiérrez D., General Director, INAOE, Mexico
 
           
Advancing Embodied AI via Model-Hardware Co-Design and Edge-Cloud Collaborative Systems
Dr. Tim Kwang-Ting Cheng, Vice-President for Research and Development, The Hong Kong University of Science and Technology, China
 
Materials Engineering Innovations to Address Next-Gen Electronics Packaging Challenges
Mr. Terrance Lee, Corporate Vice President, GM, Applied Materials, USA
 
           
Partial List of Confirmed Distinguished CSTIC 2025 Keynote & Invited Speakers
           
Cryogenic CMOS: A New Era for Power-Saving Computing
Qing-Tai Zhao, Forschungszentrum Jülich
 
RRAM-based In-memory Computing for Intelligent Applications
Zongwei Wang, Peking University
 
           
The Intergration of SRAM-based Computing in Memory and DRAM-based Prcessing in Memory by 3D Stacking Techniques for AI Large Model Utilization
Hongjie Liu, Reexen Technology Co., Ltd.
    Neuromorphic X-perception
Hongwei Tan, Aalto University
 
           
  Bioinspired Nanoelectronics
Damien Querlioz, CNRS, Université Paris-Saclay
 
Flip 3D (F3D): A dual-sided integration technology for future's computing hardware
Heng Wu, Peking University
 
           
 
Novel Low-Dimensional Material-Based Hot Carrier Transistors
Chi Liu, Institute of Metal Research, Chinese Academy of Sciences
    Optoelectronic devices
Vincenzo Pecunia, Simon Fraser University, Canada
 
           
Hafnium-based Ferroelectric Memory and its Neuromorphic Computing Application
Lin Chen, Fudan University
 
Ferroelectric Materials, Devices and Chip Technologies for Enhanced Computational and Storage Capabilities
Genquan Han, Xidian University
 
           
  Heterogeneous 3D CFET with Hybrid Channel Configuration
SangHyeon Kim, KAIST
     
           
Low-Frequency Noise of Vertical Gate-All-Around IGZO FETs
Ying Wu, Huawei Technologies
 
Defects Characterization and Their Impact on the Stability of Oxide Semiconductor Devices and 2T0C DRAM Cell
Mengwei Si, Shanghai Jiao Tong University
 
           

From "Iso-Dense" Biasing to "Inverse Lithography:" Milestones in Optical Proximity Correction Technology
Michael Rieger, Synopsys (retired)
 
TBD
Linyong (Leo) Pang, D2S Inc., USA
 
           
EUV CAR-NTD for Chemical Stochastic Reduction
TORU FUJIMORI, FUJIFILM Corporation
 
Advanced logic design rule optimization with complete physical model in lithographic simulation in DUV and EUV
Qiang Wu, Fudan University, China
 
           
EUV lithography modeling with high efficiency and accuracy
Jiamin Liu, Huazhong University of Science and Technology, China
 

TBD
Guangyuan Zhao, Hongkong Chinese University
 
           
Methodology on Adaptive Iterative Step in Inverse Lithography
Fei Ai, University of Chinese Academy of Sciences
 
The evolving laser mask writer, a cornerstone for the semicon industry
Robert Eklund, Mycronic AB
 
           
It Is about Time to Rethink and Reteach Diffraction
David H. Wei, Quantica Computing, LLC
 
The integration and process challenges and solutions for advanced technology nodes
David Xiao
 
           
  Challenges and latest developments on photo resisters for advanced logic and memory technology nodes
Allen Chang, JSR Taiwan, China
 
Pulsing Plasma Application for Advanced Dry Etch Process
Zhongwei Jiang, Beijing NAURA Technology Group Co., Ltd.
 
           
  Patterning challenges and perspectives solutions in advanced DRAM technology nodes
Hongbo Sun, Beijing Chaoxian Memory Research Institute
    The pattern solutions for GAAFET
Min Xu, Fudan University
 
           
Mechanism and Effect of 4-Level RF Pulsing on Etching Process in Advanced Node
Yang Ding, Advanced Micro-Fabrication Equipment Company Inc.
    Latest new results and developments of TSV for advanced 3DIC applications
Chao Lv, Beijing NAURA Technology Group Co., Ltd.
 
           
Ion Beam Etching as a Patterning Solution for Memory Applications
Yuxin Yang, Jiangsu Leuven Instruments Co., Ltd.
 
Effects of ALE Capabilities and DC Pulsing in Microwave ECR Plasma on Etching Processes for Cutting-Edge Logic LSI
Masaru Izawa, Hitachi High-Tech Corporation
 
           
  Enabling Material and Process Technology Capabilities for Emerging Memory Innovation in the AI Era
Jerry Chen, Zhejiang Jingsheng M&E Co., Ltd.
 
Basic Principle and Recent Tango of Reactive Sputter Process
Qintong Zhang, Beijing NAURA Technology Group Co., Ltd.
 
           
  TBD
Yukihiro Shimogaki, Tokyo University
 
A structural perspective of ALD precursors' physical and chemical properties
Xiabing Lou, Suzhou Origin Materials Technology Co,. Ltd.
 
           
Progress and outlook in GaN devices and its system implementation
Hongyu Yu, Southen University of Science & Technology
    PVD related
Xinfeng Zhang, Semiconshop
 
           
Diamond based heterjunction devices: the future of diamond electronics
Haitao Ye, University of Leicester
 
Synthesis and optical properties of two-dimensional materials and their applications in optoelectronics
Chunxiao Cong, Fudan University
 
           
Process solution for multiple Vt engineering beyond 3nm technology node
Xiaona Zhu, Fudan University
 
Implant Applications and Products to Enable Advanced Power Device Scaling and Revolution
David(Wei) Zou, Applied Materials
 
           
Inline Non-contacting Measurement of Effective Work Function
Zheng Zou, GHS Semiconductor Co. Ltd.
 
Material and Process Advances in Extending BEOL Cu Metallization and Beyond
George Wu, GHS Semiconductor Co. Ltd.
 
           
Innovative Pathways: Exploring New Frontiers with Established Chip Manufacturing Techniques
Yunlong Li, Zhejiang University
 
Interconnect Technology Evolution to Enhance Device Performance
Hongxiu(Libbert) Peng, Anji Microelectronics Technology (Shanghai) Co. Ltd
 
           
The Challenges And Solutions of Damascus Copper Process
Zhaoqin Zeng, Shanghai Huali Integrated Circuit Corporation
 
IGZO 2T0C 3D DRAM
Di Geng, IMECAS
 
           
Grinding and Chemical Mechanical Polishing Applications in Advanced Packaging
Xinchun Lu, Hwatsing Technology Co.,Ltd
 
Post Metal CMP Cleaning Technology Processes and Materials
Guanghong Luo, Yantai Xianhua Polymer Materials Ltd.
 
           

Challenges and Solutions of Wet Processes in Semiconductor Manufacturing
Zhiyong Xie, Beijing NAURA Technology Group Co., Ltd.
 

The compression deformation and particles removal of PVA brushes during the post-CMP cleaning process
Shu Yang, ACM
 
           
  Application of ultra-low SG hard pad in CMP
Yijie Luo, HUBEI DINGLONG CO.LTD.
    Improvement of W CMP Erosion Defect and Planarization Performance
Yu Yao, Semiconductor Technology Innovation Center (Beijing) Corporation, Beijing, China
 
           
  Retaining Ring Waer Study with Ceria Slurry for Chemical Mechanical Planarization
Jialiang Huang, Anji Microelectronics Technology (Shanghai) Co., Ltd.
 
Analysis of thermal effects in chemical mechanical planarization (CMP)
Taesung Kim, Sungkyunkwan University
 
           
           
FPGA-based Test Platform for 56-Gbps NRZ Digital ICs and Systems
Dave Keezer, Eastern Institute for Advanced Study (EIAS), China
 
High-throughput Metrology Solution Driven by Advanced AI
Xinheng Jiang, Hitachi High-Tech
           
  TBD
Gang Qu, University of Maryland
 
Trends and Inflections in wafer metrology and inspection
Siqun Xiao,Applied Materials China
 
           
Investigating Self-Test, Self-Diagnosis, and Self-Recovery (3S) Techniques for Wafer-Scale AI Chips
Cheng Liu, State Key Lab of Processors (SKLP)
     
           
Wearable ultrasound technology for deep-tissue monitoring
Hongjie Hu, Peking University
 
Advancing material innovations to seamlessly integrate flexible sensors with rigid chips
Yuqing Zheng, Peking University
 
           
Nanoelectromechanical Switches for Energy-Efficient Logic
Jinchi Han, Peking University
 
Integration of 2D semiconductor based transistors for advanced logic nodes
Yuanyuan Shi, University of Science and Technology of China
 
           
Smart Micro-Electromechanical and Nano-Photonic Devices Enabled by a Phase Transition
Kaichen Dong, Tsinghua Shenzhen International Graduate School, Tsinghua University
 
Neuromorphic vision sensor
Shi-Jun Liang, Nanjing University
 
           
Computational Design of Sustainable 2D Semiconductors, Interfaces and Devices
Yeesin Ang, Singapore University of Technology Design
 
Energy Intelligent Computing Devices Based on 2D Materials
Heejun Yang, Korea Advanced Institute of Science and Technology
 
           
Functional Memristor for Biomimetic Sensory Computing
Suting Han, The Hong Kong Polytechnic University
 
3D micro-/nano-fabrication for high performance nanophotonics and sensors
Faheng Zang, Shanghai Jiao Tong University
 
           
Hybrid Laser Manufacturing of Flexible and Conformal Electronics
Kaichen Xu, Zhejiang University


Metal Oxide Based Heterostructured Nanomaterials Prepared by ALD for Effective Gas Sensors
Hong-Liang LU, Fudan University
 
           
Integrated Fabrication and Applications of MEMS Devices on Ultra-thin Cylindrical Substrate
Zhuoqing Yang, Shanghai Jiao Tong University
 
Chip tech for life science and medicine
Chang Chen, Shanghai Jiao Tong University
 
           
Applications and Challenges of Voltage-Controlled Magnetic Anisotropy (VCMA)
Albert Lee, Inston Tech.
 
Embedded MRAM and Support Circuitry Design Considerations
Hao Cai, Southeast University, China
 
           
IC and MEMS application in gas sensors
Anbo Guo, Semeatech Technology Co., Ltd. and Promisense Electronic Co., Ltd.
 
Genetic Algorithm as a Design Tool for Freeform MEMS Device
Chen Wang, University of Leuven
 
           
Highly Reliable RRAM Technology Development for Advanced Tech Node
Xiangchao Ma, Beijing InnoMem Technologies Co., Ltd
 
Sensing and reliability design in commercial airspace industry
Zhikang Lan, Nanjing Gova Technology Co.,Ltd
 
           
How 3D-IC speed-up High Memory Bandwidth AI Chip
Miao Liu, Cadence (Shanghai)
 
AI Empowered Radio-Frequency Power Amplifier Design and Modelling
Jianguo Ma, Zhejiang University, Zhongyuan University of Technology
 
           
  TBD
Rongjian Liang, NVIDIA, USA
 
Hop-CIM: An All-Digital Two-level Approximate SRAM-CIM Macro for High Energy-Efficient HNN Acceleration with Data-Aware Early Exit Mechanism
Yanan Sun, Shanghai Jiao Tong University
 
           
Transforming AI: The Impact of Computing-in-Memory on Future Technologies
Tony Tae-Hyoung Kim, Nanyang Technological University, Singapore
 
TBD
Yu-Guang Chen, National Central University, Taiwan, China
 
           
Open Source Chip: Achievement and Challenges
Yungang Bao, Chinese Academy of Science, Institute of Computing Technology
 
LLM Enhancement for Secure RTL Generation
Yier Jin, University of Science and Technology of China
 
           
TBD
Yongqiang Lyu, Tsinghua University
 
TBD
Jianlei Yang, Beihang University
 
           
TBD
Xin Lou, ShanghaiTech University
 
Machine Learning for the Design of MEMS Devices
Michael Kraft, University of Leuveny
 
           
The Multi-physics Simulation and Optimization for AI Hardware Systems
Wenliang Dai, Xpeedic
  TBD
Yu Li, Zhejiang University
 
           
Reliability-Aware DTCO: A Key Strategy for Post-Moore Semiconductor Scaling
Zhigang Ji, Shanghai Jiao Tong University
 
Thin film transistor for temporal self-adaptive reservoir computing with closed-loop architecture
Peng Huang, Peking University
 
           
FabGPT for Smart IC Manufacturing: Overcoming Challenges in Data, Multimodality, and Deployment
Qi Sun, Zhejiang University
 
Innovative Deep Learning Algorithm for Improving Defect Inspection Performance of E-Beam Inspection Equipment
Chunying Han, Dongfang Jingyuan Electron Co., Ltd.
 
           
Pioneering Decision Systems in Semiconductor Manufacturing: Harnessing Mixture- of - Agents Networks with Multi-Modal LLMs to Integrate Engineering Expertise
Andrew Guan, Shenzhen FutureFab.AI Software Inc.
 
Large scale silicon photonics and system
Xingjun Wang, Peking University
 
           
Computational Lithography Empowered by Artificial Intelligence and Large Models
Hao Geng, Shanghai Tech University
 
Accelerating Power Signoff for 3DIC Design
Zhuo Xie, Hangzhou Xinspector Electronic Technology Co., Ltd.
 
           
AI-Assisted Techniques for Taming Device Variations in Non-Volatile Memory-Based Systems
Zheyu Yan, Zhejiang University
    TBD
Fan Yang, Fudan University