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Conference Plenary Speakers (2026)
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Partial List of Confirmed Distinguished CSTIC 2026 Keynote & Invited Speakers
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TBD
Mario Lanza, National University of Singapore
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Backside Power Delivery: an Industry Perspective
Han Li, Southest University
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TBD
Zhe Cheng, Peking University
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Subnanosecond 2D Flash Memory
Chunsen Liu, Fudan University
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MOS Interfaces of Emerging Channel Materials
Mengnan Ke, Yokohama National University
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High Performance Transistor and Memory Based on 2D Materials
Jiangbin Wu, Institute of Semiconductors, CAS
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TBD
Yiming Sun, Huawei
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HfO2 based FeFET for High Reliability Memory and Compute-in-Memory Applications
Kechao Tang, Peking University
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TBD
Huihui Li, Changxin
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In-Memory Computing for Large Language Model
Shaodi Wang, Witmem
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TBD
Suting Han, Hong Kong PolyU
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TBD
Qiming Shao, Hong Kong University of Science and Technology
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Ion Beam Technology for Advanced Patterning of Logic and Memory Devices
Cheng Li, Leuven Instruments
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Plasma Etch and Defect Reduction
Pengkai Xu, HLMC
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IBS Enhanced DRAM technology: The New Patterning Revolution Brought about by New Tools
Juhani Xiang, CXMT
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Tungsten-Doped Carbon Hard Mask Etch Profile Control for High-Selectivity Channel Hole Etching
Nikky Shan, YMTC
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Wet Clean Optimization to Control the Cu Loss in BEOL AIO Process
DongMei Zhai, STIC
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The Challenge of Etch Process in Advanced Memory Technology
Zhonghua, Jin SAMT
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Study of Different Selective Etching Methods in Process of Gate-all-around FET
Junjie Li, IMECAS
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ICP Etch For Advanced Technology Nodes
Tao Zhong, Naura
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Synergy of Ion and Highly Reactive Species in Cryogenic Plasma Etching
Yingxin Guan, AMEC
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Etch Solutions for Advanced Specialty
Li Ying, Lam Research
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Characterization and Diagnosis of Etch Chamber and Etch Process Based on In Situ Deposition
Xiaowei Li, Leuven Instruments
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TBD
Dave Keezer, Eastern Institute of Technology, China
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Reliability and Test Challenges for Multi-Core Cyber-Physical Systems
Zebo Peng, Linköping University
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TBD
Gang QU, University of Maryland
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Piezoelectric Micromachined Ultrasonic Transducers for Advanced Sensing Applications
Yipeng Lu, Peking University
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Wide Bandgap Semiconductor for Power Management in Future Society
Jin Wei, Peking University
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Water Based Photodetector and Chips
Shi-Sheng Lin, Zhejiang University
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1T FDSOI-based >1000fps Image Sensor with In-pixel Computing
Peng Huang, Peking University
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Multi-functional Sensing Technology for Self-Powered Microsystems
Xiaosheng Zhang, University of Electronic Science and Technology of China
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2D Materials in Post-Moore Electronics-Energy Devices: From Atomic Interfaces to Intelligent Systems
Lin Jiang, Shanghai University
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Thermal Managenment of Chiplet
Yunna Sun, Shanghai Jiao Tong University
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Batch EPI Technology for 3D DRAM Si/SiGe Superlattice
Haoran Shi, Xingyuanchi Co Ltd
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Artificial Intelligence for 2D Materials and Devices
Yong Xie, Xidian University/ICMM-CSIC
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An Ultra-High Vacuum (UHV) Device for Josephson Junction Fabrication
Baosheng Du, Suzhou Youlun Vacuum Equipment Technology Co.,Ltd
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Universal Mateials Integration for Cross Dimensional Devices
Chen Wang, Tsinghua University
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Wearable Ultrasound Technologies for Deep-Tissue Monitoring
Hongjie Hu, Peking University
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(Sc)AlN based Piezoelectric MEMS for Ultrasonic Sensing
Bowen Sheng, Peking University
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Wafer-Scale Heterogeneous Integration XOI for Power, Photonic, & Acoustic Devices
Shibin Zhang, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences
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Wet Process Equipment and Temporary De-bonding Technology
Liping LI, TAZMO Japan
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Next-Generation RF Filter Technologies for 6G and Wi-Fi 8
Chengjie Zuo, University of Science and Technology of China
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3D-Structured Photodetectors based on 2D Materials
Tao Deng, Beijing Jiaotong University
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Opportunities for Energy Saving by Implementation of WBG Power Devices
Mikael Östling, Royal Institute of Technology (KTH)
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Near Zero Power MEMS Sensors Enabled by a Phase Transition
Kaichen Dong, Tsinghua University Shenzhen
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(MEMS based) Structural Health Monitoring on Liquid Hydrogen Tanks
Ray Saupe, Fraunhofer ENAS
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TBD
Miao Liu, Cadence (Shanghai)
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Challenges and Considerations for Ultra-Large-Scale Full-Chip Power Integrity Signoff
Ji Li, Shanghai LEDA Technology
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TBD
Runjie Zhang, PHLEXING
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AI for Hardware Formal Verification
Hongce Zhang, Hong Kong University of Science and Technology (Guangzhou)
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TBD
Yuzhe Ma, HKUST (Guangzhou)
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TBD
Bei Yu, The Chinese University of Hong Kong
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Pushing the Limits of Graph Learning for Scalable and Accurate Circuit Design
Tsung-Yi Ho, The Chinese University of Hong Kong
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TBD
Xingsheng Wang, Huazhong University of Science and Technology
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TBD
Qiang Xu, The Chinese University of Hong Kong
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TBD
Guohao Wang, ZetaTech
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TBD
Bo Pu, Ningbo Detu Technology
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TBD
Chenhao Chu, ETH Zurich
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