Compound Semiconductor Asia Conference (CS Asia) 2025



Date: Tuesday-Thursday, March 25-27, 2025
Venue: 3F, Kerry Hotel Pudong, Shanghai
Location: No.1388 Huamu Road Pudong, Shanghai
Chinese and English Simultaneous Interpretation will be provided

Attendee Registration   Previous Review

The "CS Asia Conference 2025", which is one of the largest professional events about compound semiconductor industry in Asia, will be organized in conjunction with SEMICON China 2025 on Mar 25-27, 2025 in Kerry Hotel at Shanghai.


Diamond Sponsor:

Gold Sponsors:
     

SPONSORS

         
         

Featured Speakers / 特邀讲师:

Dr. Felix J. Grawert SCHOISWOHL Johannes Russell Low
Chairman of the Executive Board,CEO & President of AIXTRON SE SVP & GM of Infineon Technologies Austria AG President & CEO of Axcelis
Dr. Yun-Li (Charles) Li Jianjun (Joe) Cao GAO Chao
Chairman of PlayNitride Co-founder of EPC CTO of SICC
Dr. BARRY JIA-FU LIN Dr. Atsushi Nishikawa Daniel Twitchen
CTO of Wavetek Microelectronics CTO of ALLOS Semiconductors Executive Director, BD & Technologies Sales of Element Six
Tim Bettles David Haynes Doug Bailey
VP of Business Development of AXT VP of Specialty Technologies and Strategic Marketing of
Lam Research
VP of Marketing of PI
Dr. LIANG WU CHEN Zhengwei ZHANG Xing
CEO of Ultratrend Technologies CEO of Beijing MIG Semiconductor CEO of CSMH

CS Asia Conference - Opening Keynote / 亚洲化合物半导体大会 - 开幕主题演讲
   
Day 1- Mar.25th, 2025 Shanghai Ballroom 3 / 上海厅 3
   
13:15-13:30
Welcome Remark / 欢迎致辞
Lung Chu 居龙
Vice President, SEMI; President, SEMI China
SEMI全球副总裁、中国区总裁
   
13:30-14:00 Compound Semiconductor - Age of Maturity
Dr. Felix J. Grawert
Chairman of the Executive Board, CEO & President
AIXTRON SE
   
14:00-14:30 Reserved
IQE
   
14:30-15:00 Next Generation Power Semiconductors (SiC and GaN) Enabling A World of Decarbonization and Digitalization
SCHOISWOHL Johannes
Senior Vice President and General Manager
Infineon Technologies Austria AG
   
15:00-15:30 TBD
Russell Low
President & CEO
Axcelis Technologies
   
15:30-16:00 MicroLED Display Technology Mass Production Strategy
MicroLED 前瞻顯示技術量產策略

Dr. Yun-Li (Charles) LI 李允立
Chairman 董事长
PlayNitride Inc. 錼創科技
   
16:00-16:30 Next Generation GaN Platform for High-Density DC-DC Converters
Jianjun (Joe) CAO 曹建军
Co-founder
Efficient Power Conversion (EPC) Corporation
   
16:30-17:00 200mm SiC Substrate Development and 300mm SiC Opportunities & Challenges
200mm SiC衬底进展和300mm SiC衬底的机遇与挑战

Chao GAO 高超
CTO
SICC CO., LTD.
   
Session 1: Ultra-wide Bandgap Semiconductors Materials / 分会1:超宽禁带半导体材料
   
Day 2- Mar.26th, 2025 Shanghai Ballroom 3 / 上海厅 3
   
09:15-09:45 Recent Progress and Device Prospects on Bulk AlN Crystals Grown by PVT Method
Liang WU 吴亮
CEO
Ultratrend Technologies
   
09:45-10:15 Key Developments and Challenges in CVD Diamond Substrates for Electronic Device Applications (Pending)
Daniel Twitchen
Executive Director, Business Development & Technologies Sales
Element Six
   
10:15-10:40 The Current Industrial Situation and Prospects of The Development of The 4th Generation Semiconductor Ga2O3
第四代半导体氧化镓的产业发展现状与前景

Zhengwei CHEN 陈政委
CEO
Beijing MIG Semiconductor Co., Ltd.
   
10:40-11:05 Progress of Ultra-Wideband Diamond Semiconductor Material and Devices Research
超宽禁带金刚石半导体材料和器件研究进展

Xing ZHANG 张星
CEO
Compound Semiconductor (Xiamen) Technology Co., Ltd.
   
11:05-11:30 Reserved
 
   
Session 2: Innovative Technologies for Compound Semiconductors / 分会2:化合物半导体的革新技术
   
Day 2- Mar.26th, 2025 Shanghai Ballroom 3 / 上海厅 3
   
13:30-14:00 Reserved
 
   
14:00-14:30 Reserved
 
   
14:30-15:00 Reserved
 
   
15:00-15:30 Novel Techniques for Production Molecular Beam Epitaxy
Matthew Marek
Sr. Director of Product Line Management
Veeco Instruments Inc.
   
15:30-16:00 Precise Strain-engineering of 300 mm GaN-on-Si Micro LED Epiwafer to Open The Path to Silicon Industry Fabs
Nishikawa Atsushi
CTO
ALLOS SEMICONDUCTOR
   
16:00-16:30 Reserved
 
   
Session 3: III-V Compound Semiconductors / 分会3:III-V 化合物半导体
   
Day 3- Mar.27th, 2025 Pudong Ballroom 1 / 浦东厅 1
   
09:15-09:45 Journey through The Frequency Domain-Compound Semiconductor
Dr. BARRY JIA-FU LIN
CTO
Wavetek Microelectronics
   
09:45-10:15 Research and Development on High Power Semiconductor Edge and Surface Emitting Lasers
Shunfeng LI 李顺峰
Executive Director
Suzhou Everbright Institute of Semiconductor Lasers
   
10:15-10:40 Reserved
 
   
10:40-11:05 Scaling Compound Semiconductor Materials for Future Markets
Tim Bettles
VP of Business Development
AXT
   
11:05-11:30 Research Progress on Antimonide Lasers
Yu ZHANG 张宇
Professor
IOS, CAS 中科院半导体所
   
Session 4: GaN, SiC Materials, Equipment and Power Device / 分会4:氮化镓,碳化硅材料、设备及功率器件应用
   
Day 3- Mar.27th, 2025 Pudong Ballroom 1 / 浦东厅 1
   
13:30-14:00 TBD
Guy Moxey
VP of Power - Marketing
Wolfspeed
   
14:00-14:25 Reserved
   
14:25-14:50 Will SiC Survive The Emergence of Super-High Voltage GaN?
Doug Bailey
VP of Marketing
Power Integrations
   
14:50-15:15 TBD
David Haynes
Vice President of Specialty Technologies and Strategic Marketing
Lam Research Corporation 泛林集团
   
15:15-15:40 Reserved
   
15:40-16:05 Proposal for Solving Problems Using 4H-SiC Bonded Substrate
Koya Shimizu
President
SICOXS CORPORATION
   
16:05-16:30 Reserved
 
   

Three-day registration fee:
Type Before Mar.7 with Advanced Payment
(Early Bird)
After Mar.7 and On-site
Attendees RMB 1,500 per person RMB 2,000 per person
Speakers Free Free
* Meals and lodging are not included
* Agenda is subject to change


联系方式 / Contacts:
戚发鑫 / Daniel Qi 吴迪 / Ein Wu
Tel: 021.6027.8516 Tel: 021.6027.8509
Email: fqi@semi.org Email: ein.wu@semichina.org