Heterogeneous Integration (Advanced Packaging) International Conference: AI & CPO
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Date:
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Tuesday, March 24, 2026
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Time:
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09:30-17:55
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Venue:
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Pudong Ballroom 1, 3F, Kerry Hotel Pudong, Shanghai
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Chinese and English Simultaneous Interpretation will be provided
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Attendee Registration Previous Review
As AI computing power doubles every 3.5 months and HPC data center bandwidth needs exceed 100Tbps, traditional packaging can no longer meet next-gen industrial demands—making Heterogeneous Integration (HI) an inevitable choice. As a core forum of SEMICON China 2026, this summit, themed " Powering AI Innovations with Heterogeneous Integration Technology ", tackles the mismatch between demands and technologies head-on.
The 2026 global advanced packaging market will top $70 billion, with its growth rooted in technology’s precise response to demand: Chiplet and UCIe standards speed up to break computing bottlenecks; Co-Packaged Optics (CPO) and optical engines solve bandwidth congestion; GaN packaging iterates for automotive reliability; and HBM-HPC collaboration plus microchannel cooling breakthroughs address high-density computing challenges in data centers.
Bringing together global industry leaders and experts, the forum analyzes the inevitable path from demand pain points to technical solutions, and builds a platform for supply-demand communication and innovation collaboration.
SPONSORS
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Agenda / 议程
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09:30-09:40
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Welcome speech 欢迎致辞
冯莉，SEMI中国总裁
Lily Feng, President, SEMI China
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Keynote: Powering AI Innovation with HI
主旨演讲：异质异构集成赋能 AI 创新
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09:40-10:05
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2.5D 异构集成先进封装解决方案及发展趋势
Advanced Packaging Solutions and Trends in 2.5D Heterogeneous Integration
郭一凡，宏茂微电子， 首席技术专家
Yifan Guo, Chief Technical Fellow, Unimos
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10:05-10:30
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ASE
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10:30-10:55
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卢国强，AMF，联合创始人
Patrick Lo, Co-Founder, AMF
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10:55-11:20
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混合键合引领AI算力革命
Hybrid Bonding Leads the AI Computing Revolution
郭晓超，武汉新芯集成电路股份有限公司，代工业务处市场总监
Flora Guo, Marketing Director, XMC
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11:20-11:45
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从UCIe到UALink：连接AI基础设施的未来
From UCIe to UALink: Wiring the Future of AI Infrastructure
陈健，阿里云计算有限公司，首席云服务器架构师，资深总监
Jian Chen, Chief Architect of Cloud Server Infrastructure, Senior Director, Alibaba Cloud
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Session 1: CPO & Silicon Photonics
专题演讲：CPO和硅光
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13:30-13:50
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刘宏钧，苏州天孚光通信股份有限公司，子公司总经理 (TBD)
Russell Liu, Division GM, Suzhou TFC Optical Communication Co.,Ltd.
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13:50-14:10
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Reserved
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14:10-14:30
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为何是现在的 CPO：硅光如何成为下一代 AI 基础设施的带宽引擎
Why CPO Now: Silicon Photonics as the Bandwidth Engine for Next-Gen AI Infrastructure
何晓溪，IDTechEx，首席研究顾问
Dr. Xiaoxi He, Principal Research Associate, IDTechEx
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14:30-14:50
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David Haynes，泛林集团，特色工艺及战略营销副总裁
David Haynes, Vice President of Specialty Technologies and Strategic Marketing, Lam Research Corporation
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14:50-15:10
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TBD
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15:10-15:30
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杨刚，通快中国区总裁
Dr. Gang Yang, President, TRUMPF China
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Session 2: HBM & AI Packaging
专题演讲：HBM与AI算力封装
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15:30-15:50
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面向算力芯片封装的玻璃基板技术进展与挑战
Progress and challenges of advanced glass core substrate for AI Chip packaging
于大全，厦门大学特聘教授，厦门云天半导体科技有限公司董事长
Daquan Yu, Distinguished Professor of Xiamen University, CEO of Xiamen Sky Semiconductor Co., Ltd.
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15:50-16:10
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最大化良率与性能：面向AI与HPC芯片的晶圆针测与先进封装解决方案
Maximizing Yield & Performance in Wafer Probing and Advanced Packaging Solutions for AI and HPC chips
Laurent Giai-Miniet，ERS electronic GmbH，首席执行官
Laurent Giai-Miniet, CEO, ERS electronic GmbH
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16:10-16:30
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下一代 AI 封装的挑战
Challenges for Next Generation AI Packages
Jan Vardaman, TechSearch International, Inc. 创始人兼总裁
Jan Vardaman, President of TechSearch International, Inc.
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16:30-16:50
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TEL
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16:50-17:10
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先进封装设备赋能异构集成新生态
Advanced Packaging Equipment: Eabling the Future of Heterogeneous Integration
耿波，北京北方华创微电子装备有限公司，POP事业单元总经理
Geng Bo, General Manager of the POP Business Unit, Beijing NAURA Microelectronics Equipment Co., Ltd.
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17:10-17:30
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X射线硬件与AI软件融合：重构HBM封装三维检测
X-ray hardware meets AI software：rapid 3D inspection technology for HBM advance packaging
Isabella Drolz，Comet，市场营销与产品战略副总裁
Isabella Drolz, VP Marketing & Product Strategy, Comet
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17:30-17:50
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TBD
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17:50-17:55
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Closing Remark
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