Advanced Material International Conference


Date: Wednesday, March 25, 2026
Time: 09:00-12:10
Venue: Pudong Ballroom 5, 3F, Kerry Hotel Pudong, Shanghai
Simultaneous Interpretation will be provided.

Attendee Registration   Previous Review

In the era of advanced computing, AI, and 3D heterogeneous integration, materials innovation sits at the heart of semiconductor progress. As the industry pushes toward smaller nodes, higher performance-per-watt, and complex chiplet architectures, breakthroughs are needed not only in device design but across the entire materials ecosystem—from front-end process enablers to advanced packaging interfaces.

According to SEMI, the global semiconductor materials market is on track to surpass $80 billion by 2027, driven by demand for high-purity, high-reliability materials in logic, memory, and advanced packaging. This growth underscores the strategic importance of securing resilient, diversified, and sustainable material supply chains.

The conference this year brings together global experts and leaders, and ecosystem partners to exchange insights, explore collaborative models, and jointly shape the future roadmap of semiconductor materials.

Sponsors & Supports
         
         

Agenda / 议程
   
09:00-09:30 Registration 来宾登记
   
09:30-09:40
 Opening Remark 欢迎致辞
Lily Feng, President, SEMI China
冯莉，SEMI中国总裁
   
09:40-10:05
 Dr. Wei Li, EVP of NSIG, Chairman of ZINGSEMI and SIMGUI
李炜，上海硅产业集团执行副总裁，上海新昇及新傲科技董事长
   
10:05-10:30
Polymer-Based Materials for Advanced Packaging: Research and Applications
聚合物基先进封装材料研究与应用
Dr. Rong Sun, Director of Institute of Advanced Materials Science and Engineering, Shenzhen Institute of Advanced Technology，Chinese Academy of Sciences
孙蓉，中国科学院深圳先进技术研究院 先进材料科学与工程研究所所长
   
10:30-10:55 Shanghai Sinyang Semiconductor Materials Co., Ltd
上海新阳半导体材料股份有限公司
   
10:55-11:20 Hartmut Gerald Zahel-Mahlb, VP, SCHOTT AO
Hartmut Gerald Zahel-Mahlb，肖特先进光学事业部副总裁
   
11:20-11:45
The Challenges of Advanced Technology Nodes for Atomic-Scale Processing and Materials
先进制程对原子级制造工艺与材料的挑战
Jianheng Li, CTO, Anhui ADChem Semi-Tech Co., Ltd
李建恒，安徽安德科铭半导体科技股份有限公司首席技术官
   
11:45-12:10
Andy Tuan, Managing Director, Linx Consulting Inc. / Senior Consultant, SEMI
段定夫，Linx Consulting 亚太区执行董事 / SEMI 资深顾问
   

CONTACT US:
Hannah Zhao 021-60278571 hzhao@semi.org