Dr. Rong Sun 孙蓉
Director of Institute of Advanced Materials Science and Engineering, Shenzhen Institute of Advanced Technology，Chinese Academy of Sciences
中国科学院深圳先进技术研究院 先进材料科学与工程研究所所长

讲师简介 / Speaker Bio

Sun Rong is currently Director of the Institute of Advanced Materials Science and Engineering, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, and Dean of the Shenzhen International Institute of Advanced Electronic Materials. She has long been focused on the core technologies of key materials for advanced integrated circuit packaging materials.

She is a recipient of the Special Government Allowance of the State Council, Principal Investigator of key R&D programs of the Ministry of Science and Technology of China, Senior Member of the Institute of Electrical and Electronics Engineers (IEEE), Clarivate Highly Cited Researcher (2022, 2023, 2024), and Member of the Expert Committee for the 15th Five-Year Plan of Shenzhen. She has been repeatedly named in Stanford University's List of the World's Top 2% Scientists.

In 2006, she founded the advanced electronic packaging materials research team from scratch. Leading the team, she has realized the industrial application of high-end electronic materials such as temporary bonding materials for wafer thinning, chip-level underfill materials, and embedded capacitor materials. A fully closed-loop R&D platform integrating "physical and chemical analysis, testing, pilot-scale production, and validation" for advanced integrated circuit packaging materials has been established in Bao'an, Shenzhen.

摘要 / Abstract

集成电路是基础性、战略性、先导性产业，是人工智能、5G等领域的基础。由于晶圆制造逼近物理极限，摩尔定律发展放缓，以Chiplet（芯粒）为代表的先进封装技术，成为制造大算力AI芯片的关键。本报告将首先介绍先进封装技术与关键封装材料发展现状，其次介绍临时键合胶、芯片级底部填充胶等几种聚合物基电子封装材料的研发与产业化进展。在此基础上，介绍异质异构界面调控、原位分析检测、材料-工艺-应用协同研究等应用基础研究方面的进展。最后，报告将简要介绍中国科学院深圳先进技术研究院先进封装材料科研团队的平台建设情况及其对产业发展的支撑作用。