Design Innovation Forum: AI Intelligent Applications and Automotive IC's
| Date: | Thursday, March 26, 2026 |
| Time: | 15:30-17:30 |
| Venue: | Shanghai Ballroom 3, 3F, Kerry Hotel Pudong, Shanghai |
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Simultaneous Interpretation will be provided. |
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Artificial intelligence is rapidly reshaping the paradigms of integrated circuit (IC) design. From large-model training to edge inference, AI workloads demand unprecedented levels of compute efficiency, power optimization, and architectural flexibility—spurring innovations such as domain-specific architecture, heterogeneous integration, and AI-enhanced EDA flows. According to Yole, the global AI chip market is projected to exceed $100 billion by 2026, with design innovation at the core of competitive differentiation.This forum brings together world-class chip leaders and experts to explore the future ecosystem of intelligent ICs. It serves as a vital platform for international dialogue on how AI is reshaping the future of chip design—and how the global industry can co-innovate to meet emerging technological and market demands.