Heterogeneous Integration (Advanced Packaging) International Conference (HIIC)
| Date: | Tuesday, March 25, 2025 |
| Time: | 09:30-17:30 |
| Venue: | Pudong Ballroom 1, Kerry Hotel Pudong, Shanghai |
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Chinese and English Simultaneous Interpretation will be provided |
Attendee Registration Previous Review
Artificial Intelligence (AI) is at the forefront of the fourth industrial revolution and rapidly penetrating into everyone’s daily life such as smart Cars, IoT and ChatGPT. This creates ever-increasing demands on high transmission speed, memory capacity, and low power consumption for chips to handle massive date.As the transistor geometry scaling is approaching physical limits and no longer economic effective, advanced system integration technology, especially heterogeneous Integration(HI), will be the way to meet requirements of digital transformation, continue to unleash semiconductor technology innovation in coming decades.
Heterogeneous Integration technology integrate Chiplet in 2D, 2.5D, 3DIC process, and co-integrate electrical compute system with optical I/O and networking to create SiP (System in Package), integrated modules/subsystems or complete functional systems, provide fuel for AI revolution.
This year's HIIC conference invites global leaders and experts from advance packaging and related ecosystem industries to share the latest HIR, technological advancements, emerging trends, and their insights and visions. Audience would benefit from this forum the opportunity and challenges of Heterogeneous Integration and advanced system packaging.
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CONTACT US:
Hannah zhao
021-60278571
hzhao@semi.org