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Wendy Zhou 周妙文 Senior Director, Sales & Marketing Greater China, Amkor Technology, Inc. 安靠科技，大中华区-市场及销售，资深业务总监 |
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讲师简介 / Speaker Bio Wendy Zhou joined Amkor in 2013 and is currently a Senior Director responsible for sales account management in Greater China. She has over 20 years of experience in the IC industry, with a strong focus on China market development. Prior to joining Amkor, she served as a Supply Chain Manager at eSilicon for three years, overseeing procurement and production planning. Before that, she spent five years at ASE, working as a Process Engineer at ASE Kaohsiung and later as a Customer Engineer in the Business Development Department at ASE Shanghai. Wendy holds a Bachelor of Science degree in Engineering, specializing in Automation Instrumentation, from Northeastern University. She also completed the Senior EMBA program at Shanghai Jiao Tong University. 摘要 / Abstract The rapid expansion of the AI industry is driving significant growth in the semiconductor market. As an essential packaging technology for AI applications, chiplets help extend Moore’s Law by enabling higher levels of integration at the package level. This presentation highlights Amkor’s portfolio of advanced and 2.5D packaging solutions, including interposer applications and the key challenges we encounter in development and implementation. Amkor is well positioned to support efficient, thermally optimized chiplet based packaging solutions that help our customers succeed in their business objectives. |
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