SEMICON China - Keynote & Invited Speakers

Keynote & Invited Speakers(2022)

	Driving Moore's Law into the Next Decade Dr. Martin van den Brink, President and Chief Technology Officer, ASML	Micro-Fabrication Equipment, the Foundation of Digital Revolution and Beyond Dr. Gerald Yin, Chairman and CEO, AMEC

	Advanced 3D Chiplet Packaging Technology and Manufacturing Dr. Marvin Liao, Vice President, APTS, TSMC	An Innovative 3D HITOC 4F² DRAM Architecture Dr. Feng Hong, CEO, ICLeague Technology

Partial List of Confirmed Distinguished CSTIC 2022 Invited Speakers

	Going where silicon cannot reach: Print-in-place and recyclable electronics from nanomaterials Aaron Franklin, Duke University	Solving Optimization Problems with Nanoelectronic Neuromorphic Circuits Dmitri Strukov, University of California, Santa Barbara

	Nonvolatile-memory Based Compute-in-memory Technology for Energy Efficient DNN Accelerator Wonbo Shim, Seoul National University of Science and Technology	Study about self-heating effects in gate-all-around nanowire transistors Sangwan Kim, Sogang University

	Novel Thermal Material Properties for Post-CMOS Neuromorphic Computing Suhas Kumar, Sandia National Lab	Low Frequency Noise of Advanced Memory and Logic Devices Eddy Simoen, Imec, Belgium

	Enabling 3D Monolithic Integration using Oxide-Semiconductor-based Transistors Xiao Gong, National University of Singapore	The Road to Compatible with and Beyond Silicon Circuits for 2D Materials Peng Zhou, Fudan University

	Process Window Optimization of DRAM by Virtual Fabrication Joseph Ervin, Coventor, a Lam Research company	System-technology co-optimization for 3D monolithic memory-centric computing Bin Gao, Tsinghua University

	Optimization of endurance and operation voltage in ferroelectric field effect transistor memory devices Kechao Tang, Peking University	Recent Aadvances in Extreme Ultravoliet Photoresists Guoqiang Yang, Institute of Chemistry, Chinese Academy of Sciences

	Update of >300W High Power LPP-EUV Source Challenge IV for Semiconductor HVM Hakaru Mizoguchi, Gigaphoton	Patterning capability of surface plasmon imaging Lihong Liu, Institute of Microelectronics, Chinese Academy of Sciences

	EPE and CD performance enhancement by "GT66A", the next-generation immersion ArF lightsource Takamitsu Komaki, Gigaphoton	Thickness Dependence of Properties of EUV Underlayer Thin Films Jae-Hwan Sim, DuPont Electronics and Industrial

	Considerations in seting up industry standards for photolithography process, historical perspectives, methologies, and outlook Qiang Wu, Fudan University	Process window, stochastic defectivity, and process optimization in EUV lithography for advanced logic technologies nodes Yanli Li, Fudan University

	Nanoimprint Lithography Methods for Achieving sub-3nm Overlay Keita Sakai, Canon Inc.	Gan-based fast mask near-field calculation Yijiang Shen, Guangdong University of Technology

	Critical dimension metrology: from OCD to XCD Xiuguo Chen, Huazhong University of Science and Technology	A new generation cost-efficient laser mask writer, addressable up to the 90nm node Youngjin Park, Mycronic Co., Ltd.

	Model-driven Deep Learning for Computational Lithography Xu Ma, Beijing Institute of Technology	Lithography simulation and its applications Sikun Li, Shanghai Institute of Optics and Fine Mechanics

	Co-Optimization of Photoresist Development and Photolithography Process Liwan Yue, Ningbo Nata Opto-electronic Materials Co. Ltd	Role of underlayers in novel patterning for EUV lithography Douglas Guerrero, Brewer Science, Inc.

	Inverse lithography technology: 30 years from concept to practical, full-chip reality Leo Pang, D2S, Inc.	Advanced Lithography Material Status toward 5nm Node and beyond Koichi FUJIWARA, JSR Shanghai Co., Ltd.

	3D NAND Technology Cost Scaling Challenge and System Solutions Richard Yang, Fortune Precision Equipment, China	The fast changing and advancing scaling technique and potential device infrastructure David Xiao, Shanghai Integrated Circuit Research and Develop (ICRD) Center

	TBD Hua Chung, Mattson	High aspect ratio etch challenges and proposed ICP etch solutions Zhiqiang Liu, AMEC

	Profile control technique for High Aspect Contact Etch utilizing Coverage Controllable ALD Yoshihide Kihara, TEL, Japan	TBD Angelique Raley, TEL

	Trench Etch for SiC Power Devices Qiushi Xie, Naura	5nm fin SAQP patterning challenges and perspective solutions Qingjun Zhou, Naura

	Integrated etch solution for magnetic tunneling junction patterning Yuxin Yang, Leuven Instruments

	ALD applications in advanced nodes Weiming Li, Jiangsu Leadmicro Nano-Equipment Technology Ltd.	Process Window Optimization of DRAM by Virtual Fabrication Ervin Joseph, Coventor, a Lam Research company

	Advanced Transisitor Structure Exploration by DTCO method Shaofeng Yu, Fudan University	Dielectric CVD to address Challenges for Logic, Memory and Packaging Integration David Chu, Applied Materials

	Copper Metallization of Future Interconnects Lee Brogan, Lam Research	Keys to Extending Cu Interconnect to 2nm and Shift to Alternative Conductor Takeshi Nogami, IBM Research

	Pinch off Ultrathin Film Plasma CVD Deposition Process and Material Technology for Nano-device Air Gap/Spacer Formation Nguyen Son, IBM Research	Cutting-edge epitaxial processes of group IV materials for advanced technology nodes Andriy Hikavyy, Imec, Belgium

	Proliferation of ALD technology in the nano device era Jerry Chen, ASM	2D material and applications Zhihong Chen, Purdue University

		Development of CMP Head-to-Head Compensation Function for Gate Height Uniformity Control Yurong Que, Shanghai Huali Integrated Circuit Corporation

	Development of Post CMP Cleaning Chemistry Cass Shang, GrandiT Co. Ltd	Chemical Mechanical Planarization of Silicon Dioxide Film in Colloidal Silica based Alkaline Slurry Chenwei Wang, Hebei University of Technology

	Challenges and Solutions for Post-CMP Cleaning at Device and Interconnect Levels Jihoon Seo, Clarkson University	Characterization of Ceria and Silica Particle Loading on Post CMP Cleaning Jin-Goo Park, Hanyang University

	CMP Pads Design and Application Hongqi Xiang, Inventech Materials Co., Ltd, China	Closing the Loop: CMP Process Control Methodology and Implementation Brian Brown, Applied Materials

	TBD Chun Lu, Merck

	Recent Advances in Statistical Modelling Methodology Development for ReRAM Applications Ernest Wu, IBM Research	Faster Fault Isolation with Advanced Data Analysis and Computer Vision Franco Stellari, IBM Research

	Review of micro- and nanoprobe metrology for direct electrical measurements on-product wafers Benny Guralnik, KLA	Advanced metrology techniques for MRAM production monitoring Alberto Cagliani, KLA

	Optical Overlay Metrology Trends in Advanced Nodes Efi Megged, KLA	Advanced Applications of Picosecond Ultrasonic Technology in Semiconductor Manufacturing Cheolkyu Kim, Onto Innovation

	Improving process control and efficiency through machine learning enhanced optical metrology Michael Shifrn, Nova Measuring Instruments

	Laser Release Material for wafer level Fan-out Applications Guoping Zhang, Shenzhen Institute of Advanced Electronic Materials	Revent progress of laser induced TGV technology and it's applications Daquan Yu, Xiamen University
	Application of Single Wet equipment in WLP Yi Wang, KINGSEMI	Chiplet Cost Model Analysis, Opportunities and Challenges for Off-the-shelf Chiplets Kaisheng Ma, Tsinghua University

	Bio-inspired in-sensor vision adaptation for accurate perception Yang CHAI, The Hong Kong Polytechnic University	Characterization of neuromorphic response using a conductive atomic force microscope Mario Lanza, King Abdullah University of Science and Technology (KAUST)

	From Lab to Fab: Emerging Layered Semiconductor Industrial Synthesis, Device Engineering and Related Process Development Chen WANG, Tsinghua University	ICL heterogeneous system integration solution Odd Hung, ICLeague

	Innovations of Industry IGBT technologies and products Jianhua Liu, GTA Semiconductor	Resonant piezoelectric MEMS sensors Tianxiang Nan, Tsinghua University

	Simple MEMS technique for wide clinical applications Wei Wang, Peking University	Sensors integrated with bio materials Tie Li, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences

	TBD Ken-ya Hashimoto, University of Electronic Science and Technology of China	TBD Ting Hu, Shanghai University

	AlN based piezoelectrically actuated multi-DOF MEMS micromirror Hongbin Yu, Huazhong University of Science and Technolog

	TBD David Pan, University of Texas at Austin(UT Austin)	TBD Fan Yang, Fudan University

	Capacitance Extraction: From Random Walk to Machine Learning Wenjian Yu, Tsinghua University	Hybrid Memristor/CMOS neuromorphic circuits Peng Lin, Zhejiang University

	Analytical Optimization Method for VLSI Global Placement Jianli Chen, Fudan University	Agile Hardware Specialization for Spatial Architecture Yun Liang, Peking University

	Graph Neural Networks and Reinforcement Learning in EDA Cong Hao, Georgia Institute of Technology	Towards Independent On-Device AI: Inference without Battery and Learning without Labels Jingtong Hu, University of Pittsburgh

	Design-for-Recovery Techniques for Combating Chip Aging Issues Xinfei Guo, University of Michigan - Shanghai Jiao Tong University Joint Institute	Polynomial Formal Verification of General Tree-like Circuits Alireza Mahzoon, University of Bremen, Germany

	Algorithm and architecture co-optimization for PIM-based DNN accelerators Li Jiang, Shanghai Jiaotong University	TBD Dawei Wu, YEESTOR Microelectronics Co., Ltd

	Research on key technologies of ultra-high speed data transmission in Big Data Era Zhi-Qiang Guan, Suzhou Chiptel Microelectronics Co., Ltd	TBD Pei-Hsin Ho, Shanghai UniVista Industrial Software Group

	A Survey of Domain Specific Architecture Innovations in AI Chip Industry Yifan YangGong, CLTech	Dynamic stochastic computing and its applications Siting Liu, Shanghai Tech University