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Prof. Guoping Zhang received the B.S. and Ph.D. degrees in applied chemistry from Hunan University, Changsha, China, in 2005 and 2010, respectively. Prof. Zhang has been with the Shenzhen Institute of Advanced Technology (SIAT), Chinese Academy of Science (CAS), Shenzhen, China, since 2011. He is now the deputy director of Institute of Advanced Materials Science and Engineering, SIAT and the deputy director of Shenzhen International Innovation Institutes of Advanced Electronic Materials, SIEM.
Focusing on the relationship between structure design and performance of smart polymer materials, Prof. Zhang devotes himself to the research topic of "smart and stimuli-responsive polymer materials for the application in wafer level package". So far, Prof. Zhang has 100 SCI or EI papers include 1 ESI highly cited paper，with total citations of 2243 times and H-factor of 26. Meanwhile, Prof. Zhang has 48 patents granted in China. Prof. Zhang successfully developed temporary bonding/de-bonding (TBDB) materials and achieved mass production in advanced packaging.
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