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Cass Shang, graduated from Peking University in 1987 with bachelor degree and University of Colorado in 1998 with master degree major in material surface analysis. She then joined DuPont and worked for 20years, from 1999 to 2019. In DuPont, she was focusing on IC manufacturing CMP slurry, post etch residual removal, and post CMP cleaning formulation development, qualification and product commercialization. She successfully developed products include copper CMP slurry (first introduced into Intel 22nm Cu process), photoresist stripping chemical (EKC162) and PCMP56xx series products. She also responsible for new product introduction and qualification for U.S. customers (like Global Foundry, Intel, Samsung...). She joined GrandiT Co. Ltd in July, 2021 as chief scientist. So far, Cass hold 7 US patents and published over 20 technical papers.
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