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Graduated from the school of chemistry and chemical engineering of Nanjing University in 2007, majoring in polymer chemistry and physics, with a master's degree. After graduation, he worked in the lithography Engineering Department of Shanghai Huahong Grace Semiconductor Co., Ltd., responsible for the lithography process development and maintenance of 0.13 embedded flash products. During his stay, he participated in the transfer development of 0.13 embedded flash from R & D to mass production, won the 2010 employee scientific and technological innovation award of Zhangjiang High Tech Park, and published 3 patents. In 2012, he joined the R & D Department of SMIC and was responsible for the development of back-end metal layer lithography process of 28 nm and 20 nm logic chips. In 2016, he joined SMIC ATD, served as the manager of the BEOL lithography process R & D, responsible for metal and via layer of 14 nm logic process. During his work, he published 3 technical papers and applied for 12 patents.
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