Power & Compound Semiconductor International Forum 2022
|
Date:
|
Tuesday-Wednesday, November 1-2, 2022
|
|
Venue:
|
Yellow River Hall, 3F of Shanghai International Convention Center
|
|
Location:
|
No. 2727 Riverside Avenue Pudong, Shanghai
|
Attendee
Registration Previous
Review
The
"Power & Compound Semiconductor International Forum 2022", which is one of the largest professional events about power and compound semiconductor industry in Asia, will be organized on November 1-2, 2022 in Shanghai International Convention Center.
The Forum is a two-day program and focuses on topics including: Wide Band Gap Power Electronics, Optoelectronics, Compound Semiconductor in Communications, and Emerging Power Device Technology.
SPONSORS
|
|
|
|
Day 1 - Nov.1st, 2022
|
|
|
|
|
13:15-14:00
|
Registration / 注册
|
|
|
|
|
14:00-14:10
|
Welcome Remark / 欢迎致辞
Lung Chu 居龙
President, SEMI China; Vice President, SEMI
SEMI全球副总裁、中国区总裁
|
|
|
|
|
Opening Keynote Session / 开幕主旨演讲
|
|
|
|
|
|
Moderator / 主持人：
David Xiao肖国伟
Board Chair of AccoPower
董事长，广东芯聚能半导体有限公司
|
|
|
|
|
14:10-14:40
|
Extending The Frontiers of GaN RF Technology
Naiqian Zhang 张乃千
President of Dynax Semiconductor, Inc.
总裁，苏州能讯高能半导体有限公司
|
|
|
|
|
14:40-15:10
|
碳化硅助力新能源汽车发展
Gilbert Zhou 周晓阳
President of AccoPower
总裁，广东芯聚能半导体有限公司
|
|
|
|
|
15:10-15:40
|
Development and Applications of GaN RF Power Devices
氮化镓射频功率器件的研究与应用
Jin-Ping Ao 敖金平
Professor of Jiangnan University
教授，江南大学
|
|
|
|
|
15:40-16:10
|
Challenges and Opportunities of Design Technology Co-optimization for SiC MOSFET Fabrication in China
碳化硅产业发展机遇和挑战
Shu YUAN 袁述
Professor, Chairman of SiCChip Technologies Inc.
董事长/教授，中科汉韵半导体有限公司
|
|
|
|
|
16:10-16:40
|
Technology of Silicon Carbide Epitaxy and Wafer Manufacturing
碳化硅外延与晶圆制造技术
Rong Xuan 宣融
GM of Best Compound Semiconductor Co., Ltd.
总经理，南京百识电子科技有限公司
|
|
|
|
|
16:40-17:10
|
Silicon Carbide Liquid Phase Crystal Growth Technology
液相法碳化硅长晶技术
Min Lu 陆敏
Board Chair of Changzhou Perfect Crystal Semiconductor Co., Ltd
董事长，常州臻晶半导体有限公司
|
|
|
|
|
Day 2 - Nov.2nd, 2022
|
|
|
|
|
|
Moderator / 主持人：
Gavin Zhu 朱廷刚
Founder & General Manager, CorEnergy Semiconductor Technology Co. Ltd.
创始人兼总经理，江苏能华微电子科技发展有限公司
|
|
|
|
|
09:30-09:55
|
Bosch Semiconductor Enables Automotive Electrification Development
博世半导体赋能汽车电动化发展
Sebastian Mueller 苏田
Head of Business Development & Strategy of Bosch Automotive Electronics (AE) China
战略部门负责人，博世中国区汽车电子战略部
|
|
|
|
|
09:55-10:20
|
Talk “Power & Compound Semiconductor”
ALD 在功率化合物半导体领域的技术新突破
Winson Ye 叶惟
Sales Director of Qingdao Sifang SRI Intellectual Technology Co. Ltd
销售总监，青岛四方思锐智能技术有限公司
|
|
|
|
|
10:20-10:45
|
Improving SiC and GaN Device Performance and Production Yield By EFA and PFA Analysis
利用电学及物性分析对SiC及GaN器件的性能及良率提升
Xiaoxiao Cao 曹潇潇
Senior Manager of Market and Business Development, Thermo Fisher Scientific
市场及业务拓展资深经理，PFA，赛默飞世尔科技
|
|
|
|
|
10:45-11:10
|
PPACt Enablement of Next Generation Power Electronics
PPACt 赋能下一代功率电子
Zheng Yuan
VP, ICAPS, Applied Materials
|
|
|
|
|
11:10-11:35
|
Extending GaN Integration to Higher Power and Faster Speeds – An Examination of The Progress and Roadmaps for GaN Integration
氮化镓（GaN）集成电路可以实现更高的功率和更快的速度 — 探讨GaN集成电路的进程和路线图
Alex Lidow
CEO and Co-founder of Efficient Power Conversion
首席执行长兼联合创始人，宜普电源转换公司
|
|
|
|
|
11:35-12:00
|
碳化硅产业装备解决方案
Boyu Dong 董博宇
Vice President&CVD Business Unit General Manager, Beijing NAURA Microelectronics Equipment Co.,Ltd
副总裁兼CVD事业部总经理，北京北方华创微电子装备有限公司
|
|
|
|
|
12:00-13:30
|
Break / 休息
|
|
|
|
|
|
Moderator / 主持人：
Min Lu 陆敏
Board Chair of Changzhou Perfect Crystal Semiconductor Co., Ltd
董事长，常州臻晶半导体有限公司
|
|
|
|
|
13:30-13:55
|
New Trend and Future Development of InP Industry
InP产业的新趋势和发展
Niefeng Sun 孙聂枫
Professor of The 13th Research Institute of China Electronic Technology Group Corporation
教授，中国电子科技集团公司第十三研究所
|
|
|
|
|
13:55-14:20
|
High Volume Manufacturing of Compound Semiconductors Epitaxy
化合物半导体外延量产技术
Ziwen Fang 方子文
Vice General Manager of AIXTRON China
中国区副总经理，德国爱思强股份有限公司
|
|
|
|
|
14:20-14:45
|
Accelerating Reliability for Automotive Ics
提高汽车芯片的可靠性
Xiaolin Cai 蔡晓林
Applications Manager of KLA Corporation
产品应用经理，KLA Corporation
|
|
|
|
|
14:45-15:10
|
The Status & Future Prospects of Wide Bandgap Industry
宽禁带半导体产业现状与未来展望
Sammy Li 李宛曈
CMO of SICC CO., LTD
营销总监，山东天岳先进科技股份有限公司
|
|
|
|
|
15:10-15:35
|
Plasma Etch & Deposition Processes for SiC Devices in Power Applications
Steven Chen 陈怡骏
Technical Engagement Manager, China
SPTS Technologies Ltd
|
|
|
|
|
15:35-16:00
|
Enabling High Volume Power & Compound Semiconductor Device Manufacturing Through Innovative Ion Implant Solutions
通过创新的离子注入解决方案助力功率和化合物半导体器件大规模量产
Steve Zhao 赵洪辰
Application Director of Axcelis Technologies, Inc.
|
|
|
|
|
16:00-16:25
|
Closing Keynote: Opportunities for China's Silicon Carbide Power Devices and Industrial Chain in The New Energy Time
国产碳化硅功率器件和产业链在新能源时代下的机遇
Weijiang Ni 倪炜江
GM of Topelectronics.
总经理，安徽芯塔电子科技有限公司
|
|
|
|
|
16:25-16:40
|
Lucky Draw 幸运抽奖
|
|
|
|
|
|
|
Two-day registration fee:
|
Type
|
Before Oct. 14 with Advanced Payment(Early Bird)
|
After Oct. 14 and On-site
|
|
Attendees
|
RMB 800 per person
|
RMB 1,000 per person
|
|
Speakers
|
Free
|
Free
|
* Lunch is not included
* Agenda is subject to change
Contacts：
