Power & Compound Semiconductor International Forum
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功率及化合物半导体主题活动安排
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时间/Time
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活动名称/Event
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6月30日 09:00-17:00
Jun. 30th 09:00-17:00
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功率及化合物半导体国际产业论坛
Power & Compound Semiconductor International Forum
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7月1日 09:20-17:00
Jul. 1st 09:20-17:00
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功率及化合物半导体汽车应用发展高峰论坛
Power & Compound Semiconductor Applications in Automotive Summit Forum
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地点：三楼，欢1厅，上海卓美亚喜玛拉雅酒店（上海浦东梅花路1108号）
Venue: Grand Ballroom 1, 3F of Jumeirah Himalayas Hotel Shanghai (1108 Mei Hua Road, Pudong, Shanghai)
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Chinese and English Simultaneous Interpretation will be provided
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Attendee
Registration Previous
Review
The
"Power & Compound Semiconductor International Forum", which is one of the largest professional events about power and compound semiconductor industry in Asia, will be organized on June 30-July 1, 2023 in Jumeirah Himalayas Hotel Shanghai.
The Forum is a two-day program and focuses on topics including: Wide Band Gap Power Electronics, Optoelectronics, Compound Semiconductor in Communications,Emerging Power Device Technology, and Applications in Automotive.
SPONSORS
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08:30-08:55
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Registration / 注册
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08:55-09:00
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Speakers' Group Photo / 讲师合影
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09:00-09:10
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Welcome Remark / 欢迎致辞
Lung Chu 居龙
Vice President, SEMI; President, SEMI China
SEMI全球副总裁、中国区总裁
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Moderator / 主持人：
徐伟，广东芯粤能半导体有限公司，总经理
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09:10-09:35
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GaN Ground
日益渗透的氮化镓功率应用
Gavin Zhu, Founder & CEO of CorEnergy Semiconductor Technology Co. Ltd.
朱廷刚，江苏能华微电子科技发展有限公司，创始人兼总经理
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09:35-09:55
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Enabling Silicon Etch Solutions for Advanced Power Electronics
为先进功率电子提供硅刻蚀解决方案
Dr. David Haynes, Vice President of Specialty Technologies and Strategic Marketing, CSBG, Lam Research Corp.
David Haynes博士，泛林集团客户支持事业部战略营销副总裁
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09:55-10:15
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Technical and Industrial Development of The Silicon Carbide Substrate
碳化硅单晶衬底制备技术和产业相关进展
高超，山东天岳，CTO
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10:15-10:35
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GaN Power Electronics Beyond Adapter Applications
后快充时代的氮化镓功率器件产业化
Wang Ronghua, Vice President of Runxin Microelectronics
王荣华，润新微电子（大连）有限公司，副总经理
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10:35-10:55
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Next Generation Power Electronics - Challenges and Solutions for Scaling in High Volume Manufacturing
下一代电力电子 - 大批量制造中扩展的挑战和解决方案
ZHENG YUAN, Corporate Vice President of Product and Technology, ICAPS, Applied Materials, Inc.
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10:55-11:15
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Domestic Silicon Carbide Equipment Help The Rapid Development of The Third-generation Semiconductor Industry
国产碳化硅装备助力三代半产业腾飞
Boyu Dong, President of Beijing NAURA Microelectronics Equipment Co.,Ltd.
董博宇，北京北方华创微电子装备有限公司，总裁
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11:15-11:35
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High Throughput Epitaxy Solution for Compound Semiconductors
化合物半导体的高产能外延解决方案
Ziwen Fang, Vice General Manager of AIXTRON China
方子文，德国爱思强股份有限公司，中国区副总经理
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11:35-13:30
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Break / 休息
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Moderator / 主持人：
李顺峰，苏州半导体激光创新研究院，执行院长
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13:30-13:50
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Progress in 6-inch Liquid Phase Silicon Carbide Crystal Growth Technology
6英寸液相法碳化硅长晶技术进展
Min Lu, GM/Board Chair of Changzhou Perfert Crystal Semiconductor Co., Ltd.
陆敏，常州臻晶半导体有限公司，总经理/董事长
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13:50-14:10
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Shaping a Greener Tomorrow: The Impact of Innovative Technologies on Sustainability
塑造一个更绿色的明天： 创新技术对可持续性的影响
Francesco MUGGERI, VP of Power Discrete & Analog Products, APeC/China, STMicroelectronics
Francesco MUGGERI，意法半导体，亚太区功率分立和模拟产品器件部市场和应用副总裁
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14:10-14:30
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Integrated Etch & Deposition Solutions Enabling Compound Semiconductor Power Devices High Volume Manufacturing
刻蚀-沉积一体化赋能化合物半导体功率器件的大规模制造
Dr. XU Kaidong，Jiangsu Leuven Instruments Co., Ltd. Chairman of the Board & CEO
许开东，江苏鲁汶仪器股份有限公司，董事长兼CEO
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14:30-14:50
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Progress in Ion Implantation for The Manufacture of Wide Bandgap Devices
宽禁带半导体制造中离子注入技术进展
Dr. Fulvio Mazzamuto, Staff Applications Scientist of Axcelis
Fulvio Mazzamuto博士，应用科学家- Axcelis
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14:50-15:10
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Microscopy Methods for Failure Analysis in Power Semiconductors
Dr. Thomas Rodgers，蔡司显微镜全球半导体业务负责人
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15:10-15:30
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Advanced Plasma Etch and Deposition Processes for WBG Semiconductors
宽禁带半导体的先进等离子体刻蚀和沉积工艺
Dr Dave Thomas, Vice President Product Management of SPTS Technologies Ltd.
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15:30-15:55
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Applications of Laser Technology in Power and Compound Semiconductor Industries
激光技术在功率及化合物半导体产业的应用
巫礼杰，深圳市大族半导体装备科技有限公司，技术副总经理
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15:55-16:20
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Towards More Powerful and Reliable Devices - Thermo Fisher R&D and FA Solutions
Xiaoxiao Cao, Senior Manager of Market and Business Development , Thermo Fisher
曹潇潇，市场及业务拓展资深经理, PFA，赛默飞世尔
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16:20-16:45
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Green & Safe Exhaust Solutions for the Power & Compound Semiconductor Process
第三代化合物半导体工艺尾气的安全环保解决方案
Dr. Kirel Tang, CTO of Shareway Environment Technology Co., Ltd.
陈佳明，上海协微环境科技有限公司，CTO
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16:45-17:05
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我们需要什么样的SiC MOSFET
高远，泰科天润，应用测试中心总监
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7月1日 功率及化合物半导体汽车应用发展高峰论坛，精彩继续！
July 1st Power & Compound Semiconductor Applications in Automotive Summit Forum, More exciting content!
Two-day registration fee(include 6.30-7.1 Power & Compound Semiconductor event):
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Type
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Before Jun.2 with Advanced Payment
(Early Bird)
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After Jun.2 and On-site
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Attendees
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RMB 1,000 per person
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RMB 1,500 per person
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Speakers
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Free
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Free
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* Lunch is not included
* Agenda is subject to change
联系方式 / Contacts：
