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March 18-20, 2020
Shanghai New International Expo Centre

Advanced Packaging Forum - Heterogeneous Integration

Advanced Packaging Forum - Heterogeneous Integration

Date: Thursday, March 21, 2019
Venue: Pudong Ballroom 1+2+3, Kerry Hotel Pudong, Shanghai

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The challenge to achieve higher performance, smaller size, higher reliability and lower power consumption for electronic chips and products are driving the advanced packaging forward in these days.
AI, Autonomous Car, 5G, IoT and other new applications are enabling a new vision era of advanced packaging technologies-Heterogeneous Integration.
In this forum, experts from leading Heterogeneous Packaging and Testing, Equipment and Materials supplier are invited to share their treasure experiences on future technology development roadmap, challenges and packaging solution.

SPONSORS

       
       
Agenda / 议程 ( March 21, 2019, 13:00-16:55 )
   
Moderator / 主持人
Dr. Huili Fu 符会利
Senior Technical Advisor, Huawei
华为,高级技术顾问
   
13:00-13:10
Welcome and Introduction / 欢迎致辞
Lung Chu 居龙
President, SEMI China
SEMI,全球副总裁、中国区总裁
   
13:10-13:35
Development of Advance SiP Technology and Applications
先进SiP技术的开发和应用

Dr. Steve Liang 梁新夫
Senior Vice President, JCET
江苏长电科技,高级副总裁
   
13:35-14:00
Heterogeneous Product Customization:More than Moore Integration
异构产品定制:超越摩尔的集成方案

Xuewu Gao 高学武
Corporate Vice President, Mediatek Inc.
聯發科技,副總經理
   
14:00-14:25
New Interconnection in Advanced Packaging - Fan Out
先进封装最新内连接技术——扇出型封装

Oscar Feng 冯耀信
Senior Director, ASE
日月光集团,资深处长
   
14:25-14:50
The development of formulated cleans for enabling packaging processes
开发引领先进半导体封装的湿法蚀刻和清洗液

Dr. Tianniu (Rick) Chen 陳天牛
Vice President of Global SP&C, Versum Materials
慧瞻材料科技,全球表面清洗和处理副總裁
   
14:50-15:00 Break / 休息
   
15:00-15:25
Packaging Integration - A Complementary Solution to CMOS Scaling
利用封装集成技术应对CMOS缩微调整

Russell LIU 刘宏钧
VP, Marketing and BD, WLCSP
苏州晶方半导体,市场和业务拓展副总裁
   
15:25-15:50
Heterogeneous Integration for SiP
SiP异构集成

Jensen Tsai
Director, SPIL
矽品,总监
   
15:50-16:15
Increasing Strategic Relevance of Advanced Packaging for Next-Generation Semiconductor Devices
先进封装对下一代半导体器件开发密切相关

Manish Ranjan
Managing Director, Advanced Packaging Customer Operations, Lam research
泛林半导体,先进封装客户运营,董事总经理
   
16:15-16:40
Heterogeneous Integration Roadmap
异构集成路线图

Jan Verdaman
President, TechSearch International
   
16:40-16:50 Lucky Draw, Sponsored by PhiChem Materials (Mate 20 Pro)
观众抽奖,由飞凯材料特别赞助 (Mate 20 Pro)
   
16:50-16:55 Closing Remark / 闭幕词
   
* Agenda and guests may be updated without notice.
* 议程变化恕不另行通知

For more information and market promotion opportunities, please contact us:
Hannah Zhao
Tel: 021-60278571
Email: hzhao@semi.org