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March 14-16,2018
Shanghai New International Expo Centre

Win-Win: Build China's IC Ecosystem

Win-Win: Build China's IC Ecosystem

Date: Thursday, March 15, 2018
Venue: Pudong Ballroom 1+2+3, Kerry Hotel Pudong, Shanghai

Attendee Registration  Previous Review

Catalyzed by the market outlook, policy and the national fund, heat on Semiconductor industry continuously accumulate. There are many 12inch Fabs planned for the next 5 years, OSAT is expending accordingly. It is easy to build factory but difficult to make it strong and profitable. How the China Semiconductor manufacturing industry is going to enhance the core competency? How to prioritize resource, re-visit the business model, and cooperate within the ecosystem?

Sharpen the saw to win! Equipment and Material are the fundamental to Semiconductor industry, but we are still in the very low level today for its supply. Come to the forum to share the learning on Market, on technical challenge, let International and domestic company advancing Win-Win Cooperation and we are confident to make the significant progress if we work together!

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Agenda:  
   
Win-Win: Build China's IC Ecosystem - Advanced Packaging
   
Moderator:
Dr. Xinfu Liang
CTO, JCET
   
09:00-09:05
Welcome speech
Rick Gottscho
Executive Vice President & Corporate Chief Technology Officer, Lam Research
Member of the U.S. National Academy of Engineering
   
09:05-09:30
AI Packaging Applications and Solutions!
Dr. Yu-Po Wang
Director, CRD Center, SPIL
   
09:30-09:55
2.5DIC solutions for High Performance Computing
Calvin Lee
Director, Corporate R&D, ASE Group
   
09:55-10:20
Future Development and Challenge of Optical Wafer Inspection Technology in China for 22nm and Beyond
Dr. Chen Lu
Chairman and CEO of Skyverse Limited
   
10:20-10:45
Advanced Wafer Level Packaging for mmWave Automotive Devices
Seung Wook Yoon Ph.D
Director / Products & Technology Marketing, STATS ChipPAC Pte Ltd.
   
10:45-10:55
Overview of semiconductor materials market trends and technology developments
Michael Corbett
Managing Partner, Linx Consulting
   
10:55-11:20
Innovative Materials Enabling Innovative Processes for Advance Semiconductor Manufacturing
Guanyang Lin, Ph.D
Global Head of R&D and Technical Services, Merck
   
11:20-11:45
Advanced Cleaning Technology for Sub-10nm Semiconductor Manufacturing Process
Dr. Sherman Hsu
Technical Fellow, Clean Technology, Avantor
   
11:45-11:55 Lucky Draw, Sponsored by SPIL(Apple Watch&Ipad mini)
观众抽奖,由矽品科技特别赞助 (Apple Watch&Ipad mini)
   
Win-Win: Build China's IC Ecosystem - Advanced Technology
   
Moderator:
Steven Liu
Sr. Vice president of Marketing, UMC-USA
   
13:30-13:55
Reserved for AE
   
13:55-14:20
Establish China's high-end IC equipment industry
Jinrong Zhao
President, NAURA
   
14:20-14:45
Addressing IoT Applications by Leveraging 300 mm Technology Solutions to Enable New Process Capabilities at 200mm
Dr. David Haynes
Senior Director, CSBG Strategic Marketing, Lam research
   
14:45-15:10
Connecting the Future:Risks and Challenges for China’s IC Industry
James Yang
Head of Marketing, HLMC
   
15:10-15:35 Break
   
15:35-16:00
Collaborative Innovation to Advance Competitiveness of IC Industry
Jason Li
Legal/PA/GA, EVP, SMIC
   
16:00-16:25
Integrating domestic and international electronic material solutions
Anshul Sarda
VP, Electronic Special Gases, Linde Group
   
16:25-16:50
Solve Together Succeed Together with MKS Instruments
Josh Ding
Chief Technology Office for Flow Solutions, MKS Instruments, Inc.
   
16:50-17:00 Lucky Draw (Sponsored by NISSIN ION)
观众抽奖(由日新意旺特别赞助)
   
Agenda is subject to change 议程变化恕不另行通知