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March 14-16,2018
Shanghai New International Expo Centre

MEMS & Sensors Industry Group Conference Asia 2017

 
 

MEMS & Sensors Industry Group Conference Asia 2017: Creating and Capturing Value in the MEMS and Sensors Ecosystem

Date: Thursday, March 16, 2017
Venue: Pudong Ballroom 5+6+7, Kerry Hotel Pudong, Shanghai
Attendee Registration

Sponsors:  


MEMS and sensors: opportunities and challenges exist together
MEMS and sensors are already ubiquitous. Companies in the MEMS and sensors supply chain are plentiful, competitive, and innovative. As threats of commoditization, consolidation and competition increase, the impetus to gain as much value from MEMS and sensors is increasing. This is even more present in China, where the pace of commercialization is accelerating. Companies are positioning themselves as both hardware and software providers, selling chips along with the algorithms and sensor fusion to enable system integration, maximize value, and remain competitive. Sensor companies are also looking for opportunities to exploit the data analytics of sensor data and participate in that revenue potential. Understanding how to create and capture the value in the MEMS and sensors ecosystem is becoming increasingly important – everywhere in the world – including China.
We will discuss what concerns you
How do companies innovate to make integration easier and create higher revenues? What verticals provide the biggest opportunity for growth? What challenges to value exist across the markets? Which companies are blazing the trail for innovation and revenue generation and how are they doing it? How can traditional semiconductor companies also participate in this explosive growth of MEMS & Sensors, particularly in the Internet of Things? What is unique to the Chinese ecosystem?
Now is the time to increase collaboration, innovation, investment and understanding of MEMS and sensors’ diverse value-add. Speakers at this one-day conference presented by MEMS & Sensors Industry Group at SEMICON China will highlight areas of opportunity for products “on the cusp” of commercialization and provide useful, original and compelling content to the audience. The conference will also address the convergence of MEMS/sensors and semiconductors and will be of particular interest to all SEMICON China attendees.
 
Distinguished Speakers
Behrooz Abdi Ben Lee Becky Oh Leopold Beer
President and CEO CEO President and CEO Regional President Asia Pacific
InvenSense mCube PNI Sensor Bosch Sensortec
 
Agenda
Thursday, March 16, 2017
8:30–9:00 Registration

9:00–9:30
Welcome and Introduction
Karen Lightman
Vice President, MEMS & Sensors Industry Group

9:30–10:15
An IoT startup's perspective on business applications of MEMS and sensor
Vivi Zhang
Head of Global Strategy, Sensoro

10:15–10:45
Sensor Platform Value, Today, Tomorrow and Beyond...
Behrooz Abdi
President and CEO, InvenSense

10:45–11:15 Coffee/Tea Break

11:15–11:45
Smart Parking - How sensors and connectivity save money, time and our environment
Becky Oh
President and CEO, PNI Sensor

11:45–12:15
Translating Flexible Hybrid/Printed Electronics into Innovative Human-Machine Interface (HMI) and IoT Solutions
Albert Lu
CTO, Interlink Electronics

12:15–13:45 Lunch on own

13:45–14:15
How Entertainment, Automotive, and Voice Will Fuel New Demand for MEMS and Sensors
David Allan
President, Virtuix Inc.

14:15–14:45
MEMS Sensors and the Supply Chain: Improving Time to Market
Roc Blumenthal
Senior Director, Applications Marketing, SMIC

14:45–15:15
CMP process stability and tool capacity improvement with Mirra heads
Yanghua He
Senior Process Development Engineer, Qorvo

15:15–15:45 Coffee / Tea Break

15:45–16:45 Panel “Future of MEMS and Sensors in IoT and Mobile”
  Moderator:
  Sean Ding, Director of Sensing, Chief Scientist, Huawei
  Panelists:
  Leopold Beer, Regional President Asia Pacific, Bosch Sensortec
  Ben Lee, CEO, mCube
  Becky Oh, President and CEO, PNI Sensor
  Claire Peng, Senior Director of Strategy&Business Development, Huawei Hisilicon
 

16:45–17:00
Session Summary
Karen Lightman
Vice President, MEMS & Sensors Industry Group

17:00 Evening Reception
Notice: agenda and guests may be updated without notice.
 
Speaker Selection Committee:
Sean Ding, Huawei
Tomas Bauer, Silex
Ryoshin Imai, ULVAC
Peter Himes, SITRI
Anna-Riikka Vuorikari-Antikainen, Okmetic
Jesse Zhang , SEMI China
 
  Early Bird
(Before February 20, 2017)
Registration Fee
(After February 20, 2017)
Attendees 1,000RMB 1,400RMB
 
Speakers in Conference 2014-2016
Xi Wang Benedetto Vigna Xiao Tian Xu Michael Young Yang Zhao
Director General of SIMIT, Academician of CAS Executive Vice President, General Manager of the Analog, MEMS & Sensors Group, STMicroelectronics Vice President, China Semiconductor Association Director Electronic Sensing AP, Honeywell President, MEMSIC Inc.
Angelo Assimakopoulos Aaron Chang Dr. Shiuh-Wuu Lee Qian Guoliang Ian Chen
Senior Director of New Business Development, Mobile Consumer Electronics, Knowles Corporation General Manager of MEDIATEK China, MEDIATEK Executive Vice President, Technology Development, SMIC Executive Vice President, DATANG TELECOM TECHNOLOGY, LTD Senior Director MEMS, Freescale
Dr. Xijun Zhang Tomas Bauer Matt Crowley Tomy Runne Joseph Xie
Chairman and President, Nanopolis Suzhou Co. Ltd. SVP of Sales & Business Development, Silex Microsystems CEO, Vesper Senior Manager, Product Promotion, Sensor Division, Murata Manufacturing Co. Ltd CEO, QST Corporation
* Above are incomplete speaker lists, the position are subject to change.
 
         
The first MSIG conference in SEMICON China, limited sponsorship opportunities are open now.
Notice: sponsorships are available to MSIG/SEMI members only, please contact MSIG or SEMI for more membership benefits.
 
Contact us:
MSIG: Karen Lightman SEMI: Hannah Zhao
Tel: 412.390.1644 Tel: 86.21.6027.8571
Email:klightman@memsindustrygroup.org Email:hzhao@semi.org
   
DEMOGRAPHICS for MSIG Conference Asia 2016
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