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Dr. Wang funded ACM Research Inc. at Silicon Valley in January 1998, and then invented stress free Cu polishing（SFP） technology, which provided solution for Cu/ultra low k, air-gap integration. The Ultra SFP equipment has been sold to LSI Logic and Intel. He has obtained more than 100 patents in semiconductor equipment and process technology field.
Dr. Wang established JV of ACM Research (Shanghai) Inc., in together with Shanghai Venture in May 2005. Then he led 20+years experienced team from Silicon valley in together with yang, energized and passion domestic team to develop 12 inch single wafer cleaning equipment Ultra C incorporated proprietary SAPS (Space alternated phase shift) megasonic technology, which was invented in Zhangjiang, Shanghai. The Ultra C cleaning tool have been sold to Hynix Korea as the first high end semiconductor equipment invented and manufactured in China. He, as program leader, won the national “Eleventh-Five" 02 project for developing 65-45 nm SFP equipment for Cu interconnection application.
Prior to funding ACM Research in January 1998, Dr. Wang's association with Quester Technology, coupled with ten year he spent in semiconductor equipment and manufacturing processes at Osaka University, Cincinnati University, and CNS Technology, has given him extensive high-tech oriented R&D, R&D management, and marketing experience.
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