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March 14-16,2018
Shanghai New International Expo Centre

China Memory Strategic Forum

China Memory Strategic Forum

Date: Friday, March 16, 2018
Venue: Pudong Ballroom 1+2+3, Kerry Hotel Pudong, Shanghai

Attendee Registration  Previous Review

Gartner just released a rough estimate in 2017 for top 10 semiconductor manufacturing company; Samsung surpassed Intel whom was the top candidate for a long time in the industry. Memory takes one third revenue in whole industry incomes with simultaneously rising of volume and price which 17% rising in NAND and 44% in DRAM. Driven by market needs and policy support, 3 new Chinese Memory Companies are speeding up in process development. How shall the multi-national enterprises share the growth of China Memory market? How shall the new players enhance the R&D, and cooperate with global players? Industrial leaders will join the forum to share the insights.

Organizer: Co-organizer:  

Sponsors:  

     Agenda / 日程:

12:30-13:00 Registration 来宾登记
   
Moderator 嘉宾主持
Andrew Peng 彭安
CSO and Vice President of Business Development, Tong Fu Microeletronics Co., Ltd; Deputy to JEDEC Chairman
通富微电子有限公司首席策略官和业务发展副总裁,JEDEC副主席
   
13:00-13:30 Keynote Speech 主题演讲
Reserved for YMTC
Dr. Simon Yang 杨世宁博士
CEO of YMTC
长江存储科技有限责任公司,总经理(待定)
   
13:30-13:55
Unleashing MRAM as Persistent Memory
Mustafa Pinarbasi
CTO and Sr. Vice President of Magnetics Technology, Spin Transfer Technologies
   
13:55-14:20
Overcoming Manufacturing Challenges for Memory Technologies
Harmeet Singh
Corporate Vice President, Lam Research
   
14:20-14:45
Equipment and Process Technologies Enabling Advanced Memory Devices
Kaitsuka Takanobu
先端半导体技术部部长,TEL
   
14:45-15:00 Break
   
15:00-15:25
Advanced Memory Packaging Roadmap and OSAT Implications
Scott Sikorski
Vice President of Group Technology Strategy & Product Technology Roadmap for JCET Group
   
15:25-15:50
Topic: TBD
Zhiqiang Su 苏志强
Marketing strategic director, GigaDevice Semiconductor Inc.
北京兆易创新科技股份有限公司,战略市场总监
   
Agenda is subject to change 议程变化恕不另行通知