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March 18-20, 2020
Shanghai New International Expo Centre

Advanced Packaging Forum

Advanced Packaging Forum

Date: Thursday, March 19, 2020
Time: 13:00-16:45
Venue: Pudong Ballroom 1+2+3, Kerry Hotel Pudong, Shanghai

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The challenge to achieve higher performance, smaller size, higher reliability and lower power consumption for electronic chips and products are driving the advanced packaging forward in these days.
AI, Autonomous Car, 5G, IoT and other new applications are enabling a new vision era of advanced packaging technologies-Heterogeneous Integration.
In this forum, experts from leading Heterogeneous Packaging and Testing, Equipment and Materials supplier are invited to share their treasure experiences on future technology development roadmap, challenges and packaging solution.