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| Onsite | |
| Date: | Monday-Tuesday, June 26-27, 2023 |
| Venue: | Shanghai International Convention Center 上海国际会议中心 |
| No.2727 Riverside Avenue Pudong, Shanghai 200120, China 中国上海浦东滨江大道2727号 | |
| Virtual | |
| Date: | June 29-July 26, 2023 |
| Website: | SEMI Cloud Platform |
Distinguished Conference Keynote Speakers
Plenary Session
| 08:45-12:10, Monday, June 26, 2023 | |
| Meeting Room: | 3rd Floor Auditorium |
| 08:15-08:45 | Registration 来宾登记 |
| 08:45-09:15 | Opening Ceremony |
| Opening Remarks by Conference Chair | |
| Opening Remarks by SEMI | |
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Opening Remarks by STCSM |
| Presentation of the Best Student Paper Awards and the Best Young Engineer Paper Awards | |
| 09:15-9:50 | Spintronics for Greener Digital Technologies and Prospects Far Beyond |
| Prof. Albert Fert | |
| Research Director, Unité Mixte de Physique, Nobel Laureate in 2007 | |
| 9:50–10:25 | Innovations Boost Integrated Circuit |
| Prof. Ming Liu | |
| Academician of CAS, Fudan University | |
| 10:25–11:00 | Advanced Packaging Technology Challenges: an Equipment Supplier's Perspective |
| Dr. Yang Pan | |
| Corporate Vice President, Lam Research | |
| 11:00–11:35 | Endless Technological Innovation in IC Equipment |
| Mr. Jinrong Zhao | |
| Chairman of the Executive Committee, Beijing NAURA Technology Group Co., Ltd. | |
| 11:35–12:10 | From Legacy to Leading Edge: Broadband Wafer Optical Inspection for Process Control |
| Dr. Yalin Xiong | |
| Senior Vice President and General Manager, KLA Corporation | |
Parallel Symposium Oral Sessions
| Monday, June 26, 2023 | |
| 13:30-17:00 | Parallel Symposium Oral Sessions |
| Coffee Break | Conference Poster Session |
| Tuesday, June 27, 2023 | |
| 8:30-17:00 | Parallel Symposium Oral Sessions |
Training Courses
| Tuesday, June 27, 2023 | ||
| 13:30-15:00 | Workforce Development | Lithography process and key technical aspects in exposure tools, materials, and the future development roadmap |
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15:30-16:30 (online) |
Workforce Development | Post CMP Cleaning |
Symposium Sessions
Symposium I: Device Engineering and Memory Technology
Symposium II: Lithography and Patterning
Symposium III: Dry & Wet Etch and Cleaning
Symposium IV: Thin Film, Plating and Process Integration
Symposium V: CMP and Post CMP Cleaning
Symposium VI: Metrology, Reliability and Testing
Symposium VII: Packaging and Assembly
Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies