| * | to designate invite talk - 30 min | |||
| to designate regular talk - 20 min |
Monday, June 26, 2023 Shanghai International Convention Center
Meeting Room: 5A
Session I: MEMS and Sensors
Session Chair: Yipeng Lu
| 13:30-13:35 | Opening Remarks |
|
|
|
| *13:35-14:05 | Micromachined Ultrasonic Transducers (MUT) Based on MEMS Technology |
| Yipeng Lu, Peking University, China | |
| *14:05-14:35 | Broadband Graphene-Silicon Integrated Field-Effect Coupled Detectors |
| Yang Xu, Zhejiang University, China | |
| *14:35-15:05 | Achieving the ultimate sensitivity of silicon nano transistor based ion sensors |
| Zhen Zhang, Uppsala University, Sweden | |
| 15:05-15:30 | Coffee Break |
Session II: Emerging Devices and Sensors
Session Chair: Yang Xu
| *15:30-16:00 | Universal integration strategy from emerging layered semiconductor to multi-mode devices |
| Chen Wang, Tsinghua University | |
| 16:00-16:20 | Monolithic 3D Integration of Dendritic Neural Network with Memristive Synapse, Dendrite, and Soma on Si CMOS Logic |
| Tingyu Li, Tsinghua University, China | |
| 16:20-16:40 | The fabrication of InAs/InP Nanowire gas sensor by applying semiconductor technology |
| Min Bai, Northeastern University, China | |
| 16:40-17:00 | Differential Evolution with Multivariate Gaussian Sampling for Sensor Arrangement |
| Kuiling Du, Northeastern University, China | |
Tuesday, June 27, 2023 Shanghai International Convention Center
Meeting Room: 5A
Session III: Photonic and Neuromorphic Computing
Session Chair: Alex Gu
| *8:45-9:15 | Photonic Integrated Circuits using Transparent Conductive Oxides: from Materials and Devices to System Integration |
| Alan Wang, Baylor University, USA | |
| *9:15-9:45 | Accurate in-memory computing with MRAM device variation-aware adaptive quantization |
| Qiming Shao, Hong Kong University of Science and Technology, Hong Kong, China | |
| *9:45-10:15 | RRAM-based computation in memory for deep neural networks |
| Peng Huang, Peking University, China | |
| Poster Session: | |
| Near-infrared sensitivity enhancement of CMOS image sensor with Germanium on Silicon structure | |
| Hui Chen, Shanghai Huali Microelectronics Corporation | |
| Implantation Optimization in Vertical Transfer Gate Structured for CMOS Image Sensors | |
| Rukun Gai, Shanghai Huali Microelectronics Corporation | |
| A Composite Photodetector with Wide Dynamic and Small Area for DVS Applications | |
| Yaping Chen, Fudan University | |
| Improve the breakdown voltage of silicon pixel sensor with optimized multi-guard ring | |
| Peng Sun, Institute of Microelectronics, Chinese Academy of Sciences | |
| Study on Improvement of Dark Count Rate for Silicon Photomultiplier | |
| Xing Chen, Semiconductor Manufacturing International Corp. | |
| Process optimization and performance improvement of CMOS microbolometer with a salicided polysilicon thermistor | |
| Jiang Lan, Nanjing University | |
| Investigation of Vertically Stacked Horizontal Gate-All-Around Si Nanosheet Ion Sensitive Field Effect Transistor for Detection of C-reactive Protein | |
| Yang Liu, Guizhou University | |
| Develop of high performance and low noise image sensor processor based on 28nm high-K technology | |
| Chunshan Zhao, Shanghai Huali Microelectronics Corporation | |
| Flexible strain sensors pacaking | |
| Chengfeng Huang, East China Normal University | |
| Simulation Investigation on Performance of GaN-based Multi-Quantum Well Micro-LEDs for Micro-display and Visible Light Communication | |
| Pengfei Ye, Nanjing University of Posts and Telecommunications | |