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| Onsite | |
| Date: | Monday-Tuesday, March 24-25, 2025 |
| Venue: | Shanghai International Convention Center 上海国际会议中心 |
| No.2727 Riverside Avenue Pudong, Shanghai 200120, China 中国上海浦东滨江大道2727号 |
Distinguished Conference Keynote Speakers
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| Plenary Session |
| Monday, March 24, 2025 | |
| Meeting Room: | 3rd Floor Auditorium |
| 08:15-08:45 | Registration |
| 08:45-09:15 | Opening Ceremony |
| Opening Remarks by Conference Chair | |
| Opening Remarks by SEMI | |
| Presentation of the Best Student Paper Awards and the Best Young Engineer Paper Awards | |
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Heterogeneous Computing Solutions for Power-Performance Efficient On-Device AI |
| Dr. Giri Nallapati | |
| Vice President of Technology, Qua lcomm Inc., USA | |
| From the Nanometer Scale to Light Years | |
| Dr. Edmundo A. Gutiérrez D. | |
| General Director, INAOE, Mexico | |
| Advancing Embodied AI via Model-Hardware Co-Design and Edge-Cloud Collaborative Systems | |
| Dr. Tim Kwang-Ting Cheng | |
| Vice-President for Research and Development, The Hong Kong University of Science and Technology, China | |
| Materials Engineering Innovations to Address Next-Gen Electronics Packaging Challenges | |
| Mr. Terrance Lee | |
| Corporate Vice President, GM, Applied Materials, USA | |
Symposium Sessions
Symposium I: Device Engineering and Memory Technology
Symposium II: Lithography and Patterning
Symposium III: Dry & Wet Etch and Cleaning
Symposium IV: Thin Film, Plating and Process Integration
Symposium V: CMP and Post CMP Cleaning
Symposium VI: Metrology, Reliability and Testing
Symposium VII: Packaging and Assembly
Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies
Symposium IX: Design and Automation of Circuits and Systems
Symposium X: AI & IC Manufacturing
Parallel Symposium Oral Sessions
| Monday, March 24, 2025 | |
| 13:30-17:00 | Parallel Symposium Oral Sessions |
| Coffee Break | Conference Poster Session |
| Tuesday, March 25, 2025 | |
| 8:30-17:00 | Parallel Symposium Oral Sessions |
Panel Discussion
| 17:05-18:15, Monday, March 24, 2025 | |||||||
| Meeting Room: 3rd Floor Yellow River Hall | |||||||
| Industry-University Co-Play for IC Chips: Challenges, Opportunities, and Prospects | |||||||
Training Courses
| Tuesday, March 25, 2025 | ||
| 13:30-15:00 | SEMI U Tutorial: |
Photolithography and Related Technologies, Process Standards, and Future Outlook (Workforce Development) Speaker: Prof. Qiang Wu, Fudan University |
| 15:30-17:00 | SEMI U Tutorial: |
Advanced Package and 3DIC (Chiplets and HBM) (Workforce Development) Speaker: Dr. Guorong Li, Beijing NAURA Microelectronics Equipment Co., Ltd., China |