Symposium Chair: Dr. Xiaowei Li, ICT, CAS, China
| * | to designate invite talk - 25 min |
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| to designate regular talk - 15 min |
Monday, March 24, 2025 Shanghai International Convention Center
Meeting Room: 3B
Session I: Test I
Session Chair: Xiaowei Li
| 13:30-13:35 | Chairman Remarks |
| Xiaowei Li | |
| *13:35-14:00 | FPGA-Based Test Platform for 56-Gbps NRZ Digital ICs and Systems |
| David Keezer, Eastern Institute of Technology, Ningbo | |
| 14:00-14:15 | Stuckat and At-Speed Interconnect Tests for 3DIC |
| Linyun Long, Sanechips Technology Co., Ltd. | |
| 14:15-14:30 | Test of higher-power Semiconductors: Challenges and Solutions |
| Sandeep D' Souza, Elevate Semiconductor | |
| 14:30-14:45 | A DFT test power consumption optimization technology |
| Chenchang Wang, Sanechips Technology Co., Ltd. | |
| 14:45-15:00 | Low-cost ps-Level Clock Skew Testing Solution for high-performance clock conditioner on V93000 |
| Bank Liu, Advantest (China) Co., Ltd. | |
| 15:00-15:20 | Coffee Break |
Session II: Metrology I
Session Chair: Xiaowei Li
| *15:20-15:45 | Trends and Inflections in wafer metrology and inspection |
| Siqun Xiao, Applied Materials China | |
| 15:45-16:00 | In-Device SEM based Overlay Metrology on VIA Layer of Logic Process |
| Chao Zhou, Applied Materials China | |
| 16:00-16:15 | Assessing Brittleness of Substrates and Thin Layers with Nanoindentation |
| Frank Zhang, KLA | |
| 16:15-16:30 | Charge trapping defects in Al2O3/SiO2/Si structure characterized by spectroscopic second-harmonic generation |
| Yuchan Zhang, Shanghai Aspiring Semiconductor Equipment Co., Ltd. | |
| 16:30-16:45 | Applications of Picosecond Laser Acoustics for Advanced Packaging |
| Johnny Dai, Onto Innovation | |
Tuesday, March 25, 2025 Shanghai International Convention Center
Meeting Room: 3B
Session III: Relilabililty I
Session Chair: Xiaowei Li
| 08:30-08:35 | Chairman Remarks |
| Xiaowei Li | |
| *08:35-09:00 | TBD |
| Gang Qu, University of Maryland, USA | |
| 09:00-09:15 | Research on the root cause of THB failure of large size package chip to improve reliability |
| Yunhe Zhang, Sanechips Technology Co., Ltd. | |
| 09:15-09:30 | Fault Sensitivity Enhancement for RRAM-based Neuromorphic Computing Systems |
| Min Cheng, Shanghai Jiao Tong University | |
| 09:30-09:45 | Highly Effective and Flexible Device Designs for High-Voltage ESD Protection |
| Leyan Wang, Semiconductor Manufacturing International Corporation | |
| 09:45-10:00 | Research on EOS Damage of Chips Caused by Abnormal CPU Power-off Sequence |
| Shilu Zhou, Sanechips Technology Co., Ltd. | |
| 10:00-10:20 | Coffee Break |
Session IV: Test II
Session Chair: Xiaowei Li
| 10:20-10:35 | High-speed ADDA Device Test Solution on V93000 ExaScale Platform |
| Ruiqiang Liu, Advantest (China) Co., Ltd. | |
| 10:35-10:50 | Use IoT Technology to Optimize ATE Test Cell Operations and Management |
| Fangmin Chu, Advantest (China) Co., Ltd. | |
| 10:50-11:05 | Monitoring & Testing of Nanoparticle Contaminants |
| Lei Zhang, Winifred International Technology (Shanghai) | |
| 11:05-11:20 | Application of WSMX cards in sensor chip testing and the resulting simplification of test circuits |
| Liuhao Chen, Advantest (China) Co., Ltd. | |
| 11:20-13:30 | Lunch Break |
Session V: Metrology II
Session Chair: Xiaowei Li
| 13:30-13:35 | Chairman Remarks |
| Xiaowei Li | |
| *13:35-14:00 | High-throughput Metrology Solution Driven by Advanced AI |
| Xinheng Jiang, Hitachi High-Tech | |
| 14:00-14:15 | Timing Sequence Optimization Methods For Cross-Die Data Transmission |
| Jitong Zhou, Huaying Research Co.,Ltd. | |
| 14:15-14:30 | Defining Method Detection Limits (MDL) for Analysis of Contaminants Extracted from Wafers Using Chemical Solutions |
| Sophia Wen, Advantest (China) Co., Ltd. | |
| 14:30-14:45 | Cutting-Edge Optical Scatterometry and Spectral Interferometry Solutions for Advanced Packaging |
| Hila Shasha, Nova Ltd. | |
| 14:45-15:00 | V93K's solution to new test challenges for PMIC Device |
| Changqing Niu, Advantest (China) Co., Ltd. | |
| 15:00-15:20 | Coffee Break |
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Session VI: Test III Session Chair: Xiaowei Li |
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| *15:20-15:45 | Investigating Self-Test, Self-Diagnosis, and Self-Recovery (3S) Techniques for Wafer-Scale AI Chips |
| Cheng Liu, Institute of Computing Technology, Chinese Academy of Sciences | |
| 15:45-16:00 | Testing Error Correction and Repair Techniques for the Transmission Channel During Cross-Chiplet Testing |
| Kai Wang, Sanechips Technology Co., Ltd. | |
| 16:00-16:15 | 5G RedCap device and its low-cost high efficiency ATE test solution |
| Qin Feng, Advantest (China) Co., Ltd. | |
| 16:15-16:30 | A Low-Cost Multiplexer Solution for IC Testing on the V93000 |
| Jun Chen, Advantest (China) Co., Ltd. | |
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Poster Session: |
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| A General Auto Configured Characterization Test Program Generation Solution on ADVANTEST V93K ATE Platform | |
| Yefang Wang, Advantest (China) Co., Ltd. | |
| An Optimized and General Class-D Audio Amplifier Crosstalk Measurement Test Solution on ADVANTEST V93K ATE Platform | |
| Yefang Wang, Advantest (China) Co., Ltd. | |
| A Generic Solution to Handle System in Package Efuse Test in Multiple Flow | |
| Hao Chen, Advantest (China) Co., Ltd. | |
| Picosecond Ultrasonics: An Advanced Technology Utilized for Process Control of SiCr Thin Film Resistors | |
| Huayuan Li, Onto Innovation | |
| A Common Building Block for Media SoC Analog Test on ADVANTEST V93000 ATE Platform | |
| Hanyan Chen, Advantest (China) Co., Ltd. | |
| Automatically Monitor and Process V93K Pattern for Large Scale High-speed Digital Devices on ADVANTEST ATE platform | |
| Qingqing Xia, Advantest (China) Co., Ltd. | |
| CD Step Application in Edge Air Layer Structure Measurement for Bulk Acoustic Resonator | |
| Hong Hong, Onto Innovation | |
| The Process of AVS Establishment during Testing and How to Reduce Power Consumption at the Application end | |
| Liuhao Chen, Advantest (China) Co., Ltd. | |
| Investigation of Leakage Risk on HV PNP ESD devices in LDMOS platform | |
| Lei Li, Semiconductor manufacturing international corporation | |
| Correction Model for Plate Mapping Error Based on Acceleration and Deceleration of Plate Stage | |
| Yuzhi Li, Shanghai Microelectronics Equipment | |
| Effective and Innovative ATPG Solutions to Shorten TTM Based on V93000 | |
| Jun Chen, Advantest (China) Co., Ltd. | |
| Enhancing Reliability of Bipolar-CMOS-DMOS Technology through Delicately STI Optimization | |
| Xun Yang, Huahong Semiconductor (Wuxi) Limited | |
| Optimized Filling Capacity in HARP Process for STI Void Defect Improvement in 28nm Technology | |
| Zhimin Zhang, Shanghai Huali Integrated Circuit Corporation | |
| Best Practices for Chip Temperature Testing in Automatic Test Equipment | |
| Kaitao Liu, Advantest (China) Co., Ltd. | |
| Satellite Device Tech Market Trends & RF Testing Challenges | |
| Daniel Sun, Advantest (China) Co., Ltd. | |
| Analysis and Improvement of Measurement accuracy Of Insertion Loss | |
| Fan Hong, Aoshikang Technology Co., Ltd. | |
| The Different Cause Type of Poly Residue Defect for 28 HKMG Process Improvement | |
| Ruomu Li, Shanghai Huali Integrated Circuit Corporation | |
| The Impact of PID on the Degradation of LDMOS | |
| Wen Ying, Semiconductor Manufacturing International Corporation | |
| A Continuous Data Sampling Solution for MEMS ASIC Test on V93000 | |
| Hao Wu, Advantest (China) Co., Ltd. | |
| Understanding Electromigration Failure Modes in Cu Interconnects with Different Line Widths | |
| Liting Hao, GHS Semiconductor | |
| An Analytics Methodology For Anomaly Detection In Machine Log Data | |
| Wei Yu, Shanghai Huali microelectronics corporation | |
| Fault Isolation using FIB to Mitigate Interference in Failure Analysis Caused by OBIRCH | |
| Jiwei Zhou, Beijing Xuanjie Technology Co., Ltd. | |
| Optical Critical Dimension Accuracy Improvement through TEM Uncertainty Reduction | |
| Lin Du, Shanghai University | |
| Multi-core type chips binning solution on ATE | |
| Haijing Wu, Advantest (China), Co., Ltd. | |
| Wafer Position Recognition Technology on Electrostatic Chuck | |
| Yu Yao, Semiconductor Technology Innovation Center (Beijing) Corporation | |
| Probe card stability in CP tests at high temperature | |
| Wenting Xie, Advantest (China), Co., Ltd. | |
| High sensitivity Bright Field Inspection: Vera | |
| Yingchao Liu, Applied Materials China | |
| FPGA-Based Sensor Less Condition Monitoring System for GaN HEMT | |
| Yutian Gan, Southern University Of Science And Technology | |
| Low-Frequency Noise Measurements for Electromigration Characterization of Cu Interconnect under Metal Barrier Punch Through Process Optimization | |
| Chenxiao Xu, Zhejiang ICsprout Semiconductor Co., Ltd. | |
| 5G Redcap Market Trend & Test Solutions on V93000 | |
| Daniel Sun, Advantest (China), Co., Ltd. | |
| The Effect of Post Cooling Time of Single Wafer Annealing on TDDB Reliability | |
| Cunzhe He, Semiconductor Manufacturing North China | |
| A Feasible Way to Detect Energetic Molybdenum for CIS Ion Implantation Process | |
| Liang Hong, Applied Materials China | |
| Effect of Medium Current Implant Beam Half Width on Resistance | |
| Hui You, Applied Materials China | |
| Galaxycore ADC Penetration and Performance | |
| Yan Lv, Applied Materials China | |
| An Accelerating ADAS ATE Development Solution in ExaScale EX System | |
| Tianyu Zhang, Advantest (China), Co., Ltd. | |
| The Improvement of HRP Resistance Uniformity by Beam Profile Optimization | |
| Cheng Li, Applied Materials China | |
| Abstract_An Optimization Method for Monitoring Nickel Silicide Process | |
| Xiaolong Wang, Applied Materials China | |
| Wafer Placement Control for Spike Anneal | |
| Haifeng Zhu, Applied Materials China | |
| A Comprehensive Investigation about Channel Size Effects on PBTI and SILC in Planar High-K MG NFETs | |
| Sheng Chen, Shanghai Huali Integrated Circuit Corporation | |