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Date:Tuesday, March 17, 2015
Time:13:30-17:30
Venue: Pudong Ballroom 2+3 ,Kerry Hotel ,Pudong, Shanghai
It has become the Era of Mobile Internet to the Semiconductor industry since smart phone replaced PC to be the market driving force. Human to human, human to device and device to device computing and communication are everywhere. Handset, the wearable, automobile and IOT, one after another, step into our vision and rebuild our life style. SEMI China will organize the "Advanced Packaging Forum", where industry elites sit together to discuss the technology and solution for the Era of Mobile Internet.
From the market trend to product application, in conjunction with various assembly and test technology, creative equipment and material, together we map a new blueprint of the industry.
Moderator | |
13:30~13:55 | IoT Related Packaging Solutions - 2.5D / 3DIC enabling New Wave SiPs |
Walter Jau, Director, Corporate R&D, ASE Group | |
13:55~14:20 | JCET Low Cost Packaging Solution |
Anderson Bao, |
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14:20~14:45 | Next generation package solutions for mobile and IoT devices |
Chang-Yi (Albert) Lan Senior Director, Engineering Center Siliconware Precision Industries Co., Ltd. (SPIL) |
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14:45~15:10 | A temporary bonding and debonding technology for TSV fabrication |
MASAHIRO YAMAMOTO, Manager of TEL 3DI DEPT |
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15:10~15:35 | 磁控溅射物理气相沉积在先进封装中的应用 |
丁培军 北方微电子副总裁 |
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15:35~16:00 | 晶圆级封装的优势及劣势 |
16:00~16:25 | Enabling Multi-Die Integration Through Advanced Packaging |
Sesh Ramaswami Managing Director, Packaging Technologies, Silicon Systems Group, Applied Materials |
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16:25~17:25 |
Panel Discussion The Advanced Packaging Technology Demand and Challenge of Mobile Communication and IoT |
符会利, Jim Xu, Walter Jau, 包旭升, 藍章益, 丁培军 |
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Jim Xu Chief Technical Officer, Zeta Instruments |
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17:25~17:30 | Lucky draw for five gifts |
Mr. Jesse Zhang
Tel: +86-21-60278558
Email: wdzhang@semi.org
Type |
Early Bird (Before Mar.2, 2015) |
Registration Fee (After Mar.2, 2015) |
RMB 600/位 | RMB 800/位 | |
Speaker | Free | Free |