Prof. Zhe Cheng
assistant professor，Peking University

讲师简介 / Speaker Bio

Zhe Cheng is an assistant professor in the School of Integrated Circuits, Peking University. He holds courtesy appointments in the School of Software & Microelectronics and Frontiers Science Center for Nano-optoelectronics. He joined Peking University as an assistant professor after he obtained his Ph.D. degree at Georgia Institute of Technology and finished his postdoc training at University of Illinois at Urbana-Champaign. His research focuses on thermal management of electronics, advanced thermal metrology, heterogeneous integration, and interfacial thermal resistance. He published more than 60 papers on prestigious journals and conferences such as Nature Communications, IEEE IEDM, Applied Physics Reviews. He also published three book chapters. He was session chairs of conferences such as IEEE ITherm, ASME INTERPACK. He was awarded the Advanced Materials Scientist Medal from IAAM. He was a journal reviewer for Nature Electronics, Physical Review Letters, ACS Nano, Nano Letters, Advanced Materials, Materials Today, IEEE TED, IEEE EDL, Chemical Society Reviews.
摘要 / Abstract

The thermal issues of three-dimensional integrated circuits are the main challenges for high device performance and long-time reliability. Proper thermal management is the key for these electronics. However, the thermal properties inside 3D-IC are very different from their bulk materials due to size effect, defects, and interfaces, which are very important in thermal modeling and design of 3D-IC. This talk reports the experimental measurements of thermal properties inside 3D-IC by time-domain thermoreflectance (TDTR) and steady-state thermoreflectance (SSTR). High precision thermal mapping is applied to obtain the 3D distribution of thermal conductivity inside micro/nano structures inside 3D-IC, for example interconnects and bonding interfaces, highlighting the importance of thermal boundary resistance. This work will shed light on the fabrication, design, and test of 3D-IC in a thermal perspective.