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Dr. Yu-Po, Wang 王愉博 Vice President, R&D Center, SPIL 矽品，副总经理 |
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讲师简介 / Speaker Bio Yu-Po Wang received Ph.D. in Mechanical Engineering from Binghamton University, State University of New York , U.S.A. In 1997, he started career at Gintic Institute of Manufacturing Technology in Singapore. He joins SPIL in 1998 and leads the R&D Package Application and Technology Support Team in substrate/package design, material characterization and advanced package. Dr. Wang has strong knowledge and experience in packaging characterization including thermal/ electrical simulation, advanced material(co-development), design and advanced packaging development. He has over 83 patents in US. Experience: • 1997-1998 Gintic Institute of Manufacturing Technology, Singapore • 1998-Present SPIL, Taiwan, China |
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