Lincoln Lee 李立基

Integrating multiple devices into a single package reduces system real estate, manufacturing costs, and often increases quality and reliability. However, these packages present unique challenges for traditional package design tools and methodologies. Design teams must work together to verify and optimize the entire system, not just the individual elements. Given the multiple data sources and formats it is clear that expanded EDA tool support is required to ensure fast, accurate, automated flows that ensure package designers can meet their market schedules and performance expectations. Ideally these flows provide a single integrated process for electrical, stress, and test analysis built around a 3D digital model, or twin, of the entire heterogeneous package assembly.