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Rick Shen 沈杰 Chief Scientific Officer of Semiconductor Packaging, Adhesive Technologies – Electronics, Henkel 半导体封装首席科学家, 汉高粘合剂技术电子事业部 |
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个人简介 / Biography Rick Shen is the Chief Scientific Officer of Semiconductor Packaging at Henkel. He is responsible for technical service for semiconductor packaging. He has worked at Henkel for 10 years and is responsible for technical service for semiconductor advanced and memory applications, including die attach pastes, die attach films, underfills, wafer level encapsulants and package level EMI shielding. 摘要 / Abstract Introduce the trends driving advanced PKG market segment including below key factors •Data center architecture •Datacenter Processors material needs •Mobile and 5G •Mobile and 5G material needs Introduce Henkel solution for advanced packaging •Advanced underfill: Pre-apply (NCP, NCF), post-apply underfill (CUF) •Wafer level encapsulant: LCM •Lid & stiffener attach •Next generation of Henkel Semi-sintering DAP •Henkel EMI solution for package level application |
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