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Albert Lan joined Applied Materials in 2017 as Senior Global Packaging Technical Director. In this capacity, Mr. Lan works closely with customers on advanced wafer-level packaging technology development from process integration points of view including fan-out, 2.5D/3D TSV, System in Package (SiP), and CoW/WoW copper hybrid bonding.
Albert Lan brings with him over 30 years of experience in the semiconductor industry, focused on advanced wafer-level packaging technologies. Before joining Applied Materials, he served as the Head of Engineering Center at Siliconware Precision Industries (SPIL), one of the top three largest assembly houses in the world, for 13 years and at Amkor Taiwan for 6 years.
He also serves as Vice-Chairman of SEMI Taiwan's Packaging and Test Committee and Chairman of Taiwan Intelligent Leader Association (TILA) since 2005. Albert Lan has published more than 50 technical papers and granted more than 30 issued worldwide patents.
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