| ** | to designate keynote talk - 30 min | Sponsored by: |
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| * | to designate invite talk - 25 min | |||
| to designate regular talk - 15 min |
Symposium Chair: Peilin Song
Symposium Co-chairs: Baozhen Li
| Online Conference | |
| Parallel Symposium Oral Sessions: | June 29-July 17, 2020 |
| Session I: Test I | |
| * | High-Level Approaches to Hardware Security |
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Ramesh Karri, New York University, USA |
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Multi-granularity Reconfiguration Based Physical Unclonable Function Design |
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Jianan Mu, Chinese Academy of Sciences, University of Chinese Academy of Sciences, Beijing, China |
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Low-Cost Solution for Ultra-Highspeed SerDes to RF Communication Test via on Board FPGA |
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Tang Mingjie, Advantest (China) Co., Ltd. |
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A ProgrammingFframework of Concurrent Test on SMT7 for IPs which Share Same Access Port |
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Tianyu Zhang, Advantest (China) Co., Ltd. |
| Session II: Test II | |
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Low Voltage Time-Resolved Emission (TRE) Measurements of VLSI Circuits |
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Shang-Chih Lin, Gallant Precision Machining(GPM), Taiwan, China |
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Unifying Yield Enhancement and Manufacturing Intelligence with Smart Sampling |
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Zhang Yan Qiu, Fujian Jinhua Integrated Circuit Co., Ltd. |
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An Adaptive De-noise System for Sub-nm Scale Failure Analysis Based on TEM Image |
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Xu Chang, Fujian Jinhua Integrated Circuit Co., Ltd. |
| Session III: Metrology I | |
| ** | Machine and Deep Learning in optical metrology for Process control |
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Dr. Barak Bringoltz, Nova Measuring Instrument, USA |
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Wave Front Phase Imaging For Global Silicon Wafer Geometry |
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Jan Gaudestad, Wooptix, Spain |
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Optical Scatterometry Modeling of 5 nm Logic Metal Gate Structures |
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Qi Wang, Shanghai IC R&D Center |
| Session IV: Metrology II | |
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Full Metrology Solutions for Advanced RF by Picosecond Ultrasonic Metrology |
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Johnny Dai, Onto Innovation, USA |
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Monitoring Critical Process Steps in 3D NAND using Picosecond Ultrasonic Metrology with both Thickness and Sound Velocity Capability |
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Johnny Dai, Onto Innovation, USA |
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Quality Control in Sapphire Production: From Automated Defect Detection to Big Data Approach |
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Ivan Orlov, Scientific Visual SA, Switzerland |
| Session V: Reliability I | |
| * | Towards Understanding Interaction Between Hot Carrier Aging and PBTI |
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Prof. Jian Fu Zhang, Liverpool John Moores University, UK |
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Comprehensive Comparison of the Wire Bond Reliability Performance of Cu, PdCu and Ag Wires |
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Lois Liao Jinzhi, WinTech Nano-Technology Services Pte. Ltd, Singapore |
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A Study of Low Temperature Al Sputter Process Electromigration Lifetime |
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Jun Liu, Shanghai Huahong Grace Semiconductor Manufacturing Corporation |
| Session VI: Reliability II | |
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Non Linear Growth of Variance in the Process Gap |
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George W Horn, Middlesex Industries SA, Switzerland |
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Research on WBP Product Stress to Improve Product Vr Yield |
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Yang Chen, ZTE |
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A Novel Vertical Closed-loop Control Method for High-generation TFT Lithography Machine |
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Dan Chen, Shanghai Micro Electronics Equipment (Group) CO., LTD. |
| Conference Poster Session: | June 26-July 17, 2020 |
| Probe Card Lifetime Control and Abrasion Coefficient Study | |
| Lei Wang, HHGrace | |
| Metal Trench Critical Dimension and Overlay Minor Variation Monitoring Method with Voltage Contrast Inspection | |
| Lijing Huang, HLMC | |
| The Inspection Solutions and Reduction of Extreme Tiny Poly Residue | |
| Jianye Song, HLMC | |
| An Application of Adaptive Genetic Algorithm Combining Monte Carlo Method | |
| Wei Yu, HLMC | |
| Investigation and reduction of Systematic defects by wafer backside process in nanometer semiconductor manufacturing | |
| Jiangang Zhou, HLMC | |
| Study of high-precision interferometer dynamic switching for TFT long-travel-range moving stage | |
| Dan Chen, Shanghai Micro Electronics Equipment (Group) CO., LTD. | |
| Fault Detection of sensor data in semiconductor processing with variational autoencoder neural network | |
| Wang Yong, Shanghai Huali Microelectronics Corporation | |
| New Precision Jitter Measurement Solution on TMU | |
| Kai Zhou, Advantest | |
| Investigation and discovery of the integration of FEOL process by electron beam inspections | |
| Fengjia Pan, Shanghai Huali Microelectronics Corporation | |
| One Comprehensive Method to Analyze Semiconductor Manufacturing Data by "Piecewise" Regression | |
| Lin Gu, Shanghai Huali Microelectronics Corporation | |
| The inspection solutions of 3bar structure Cu void in BEOL advanced semiconductor process | |
| Zhangxingdi, Shanghai Huali Microelectronics Corporation | |
| The inspection and solution of inline CT defect for 28nm process improvement | |
| Min Wang, Shanghai Huali Microelectronics Corporation | |
| The Study and Investigation of Inline E-beam Inspection for 28nm Process Window Monitor | |
| Yin Long, Shanghai Huali Integrated Circuit Corporation | |
| A Unified 4H-SiC MOSFETs TDDB Lifetime Model Based on Leakage Current Mechanism | |
| Hua Chen, Xidian University | |
| Study on wafer edge test with optimized test solution | |
| Yuxiang Zhang, Shanghai Huahong Grace Semiconductor Manufacturing Corporation |