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Miaomiao Wang is a Research Staff Member at IBM Research Division. Her work at IBM focuses on FEOL reliability characterization and qualification for advanced CMOS technologies. She received her B.S. degree from Peking University in 2003 and Ph.D. degree from Yale University in 2008, both in Electrical Engineering. She has authored and co-authored 11 patents and more than 40 papers in peer reviewed journals and conferences. Dr. Wang has given invited talks and tutorials on device physics and reliability related subjects. She served on the technical subcommittee in several international conferences, including 2017 and 2018 IEEE International Electron Devices Meeting and 2017, 2019, and 2020 IEEE International Reliability Physics Symposium. Dr. Wang is a senior IEEE Member.
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