(** to designate keynote talk, * to designate invite talk)
Sunday, March 11, 2018 Shanghai International Convention Center
Joint Session: Symposium II and Symposium III-Lithography/Etch joint session
Meeting Room：3rd Floor Yellow River Hall 黄河厅
Session Chairs: Kafai Lai/Ying Zhang
| 13:30-13:35 | Opening Remarks |
| Kafai Lai / Ying Zhang | |
| **13:35-14:05 | Patterning Roadmap |
| Rich Wise, Lam Research | |
| **14:05-14:35 | Patterning challenges and opportunities for Advanced Memory Technology |
| Gill Lee, AMAT | |
| *14:35-14:55 | Desirable material selection on Self-aligned Multi-patterning |
| Hidetami Yaegashi, TEL | |
| 14:55-15:10 | Coffee Break |
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Session II: Advanced Patterning
Meeting Room: 3C+3D
Session Chair: Ying Zhang (AMAT)
| *15:10-15:40 | Patterning for beyond 14nm nodes |
| Lei Zhong, AMAT | |
| *15:40-16:10 | Atomic Layer Etch Modeling for Advanced Patterning |
| Peter Ventzek, TEL, US | |
| *16:10-16:40 | SAQP and SAOP for 5nm nodes and beyond |
| Efrain Altamirano Sanchez, IMEC | |
| 16:40-16:55 | Innovative Bias Power Control for IED in FEOL Etch |
| Denis Shaw, AE | |
| Poster Session: | Location: 5th Floor |
| Coffee Break | The Development of Novel STI Spacer in an EPI Free SiGe BiCMOS Process |
| Donghua Liu, HHGrace | |
| Fabrication of Silicon Nanopores with Tunable Shapes and Sizes | |
| Qi Chen, Tsinghua University | |
| Active ion-trajectory control at the wafer extreme edge | |
| Kui Zhao, AMEC | |
| Study of Plug Etch Back Process Matching on Faraday Shielded ICP and Traditional CCP Plasma Etch Chambers | |
| Yali Fu, Mattson Technology | |
| The source/drain pull back with novel plasma approach in reactive ion etch and chemical downstream etch for high-quality SiGe epitaxy layer | |
| Shaoxiong Liu, SMIC | |
| De-wetting model study on spinning substrate – Challenges for low chemical consumption | |
| Christian Haigermoser, Lam Research | |
| The Application of Pulsed Capacitively Coupled Plasmas Etching for Trench Contact Process | |
| Zhidong Wang, SMIC | |
| Challenges and Approach of Advanced Material in Plasma Etching | |
| Xingjian Chen, AMEC | |
| Germanium Compatible Photoresist Strippers and Residue Cleaners For 5nm and Below Technology Nodes | |
| Chien-Pin Sherman Hsu, Avantor | |
| Hydrogen Ash Process for Si Substrate Oxidation | |
| QIUHUA HAN, SMIC | |
| The Improvement of LWR and LER for Advanced Multi-Patterning Processes | |
| Xin Jiang, SMIC | |
| Study of AA-Etch Mask Open Process at Topography Boundary Area | |
| Han Peng, SMIC | |
| Inductively Coupled Plasma Etching vs Remote Plasma Etching for Oxide Etch Selectivity Improvement | |
| Zi Wang, SMIC | |
| A STUDY OF POST ETCH TREATMENT IN GATE ETCH PROCESS | |
| Rongyao Chang, SMIC | |
| Dynamic Thin Layer Double-chamber Wet Processing Equipment for Small Size Wafer | |
| Jason.Yin, Huaying Research Co., Ltd. | |
| The Sidewall Profile Control of Fin Recess at P-MOS | |
| Yawu Pan, SMIC | |
| Al Bevel Etch CIP for 28nm HK Products | |
| Bochen Zhong, SMIC | |
| Inversed Trapezoidal Dummy Gate Profile for FinFETs | |
| Yuchen Li, SMIC | |
| Coping the depth loading in high aspect ratio etching | |
| Stephen Liou, Lam Research | |
| Mega-sonic Effect on Sub-Resolution Assist Features during Photomask Cleaning | |
| Sophia Xue, SMIC | |
| A Study of the Advanced Plasma Etching Scheme on Metal Recess | |
| WUTAO TU, SMIC | |
| The Top Hard-Mask Loss Reduction at High Aspect Ratio Spacer Etch | |
| DongPing_Zhang, SMIC | |
| Dry Strip Assisted Reduction of High Aspect Ratio Silicon Feature Bending Post Wet Clean | |
| Dongyang Yu, Lam Research | |
| Application of CF4 Chemistry for Removing TiN/High-K Footing Residual | |
| Yiling Sun, Lam Research | |
| Chamber Wall Surface Properties Induced Change of Etching Performance | |
| Tongxun Guo, Lam Research | |
| Application of Plasma Pulsing in a Metal Gate Etch Back Process | |
| Tianyin Sun, Lam Research | |
| Top profile control of HARC etching | |
| Yichuan Zhang, AMEC | |
| Self-aligned Contact Etch Process Optimization with Pulsing Plasma Technology | |
| Erhu Zheng, SMIC | |
| Fast model building for PTD Source Mask Optimization (SMO) calibrated by dose tuning | |
| Song Bai, SMIC | |
| The Remaining Loading Control of Fin Cut Process | |
| Qian Tao, SMIC | |
| Analysis of Reversed Depth Micro-loading Based on Pulsed Plasma | |
| Chen Guodong, NAURA | |
| The Study of non-Bosch Deep Trench Etch Process | |
| Wang Jing, NAURA |
Monday, March 12, 2018 Shanghai International Convention Center
Meeting Room: 3C+3D
Session III: FEOL/MOL Etching
Session Chair: Tom Ni (AMEC)
| 8:45-9:00 | The Study of STI Etching Micro-loading in Reactive Ion Etch (RIE) |
| Yunhe Dong, NAURA | |
| *9:00-9:30 | Patterning Technology Options for Future Scaling |
| Kenjiro Nawa, TEL, Japan | |
| 9:30-9:45 | Dummy Gate Critical Dimension Uniformity Improvement for 14nm and Beyond |
| Jie Luo, SMIC | |
| 9:45-10:00 | Challenges and Optimization Approach in plasma etching with EUV lithography |
| Xiaowen Wang, AMEC | |
| 10:00-10:15 | Coffee Break |
Session IV: Plasma Source and Wet Etch/Clean
Session Chair: Tom Ni (AMEC)
| *10:15-10:45 | Resist Strip Technology for Advanced Technology Nodes |
| Shawming Ma, Mattson Technology | |
| *10:45-11:15 | Advanced Etch Technology for Patterning 14nm and beyond |
| Ying Huang, AMAT, China | |
| 11:15-11:30 | Zero Lag Dispense to Increase the Etching Uniformity in a Single Wafer Wet Cleaner |
| Wei Liu, NAURA | |
| 11:30-11:45 | Study of Downstream CF4 Contained Plasma Process Impact on Chamber Condition |
| Yali Fu, Mattson Technology | |
| 11:45-12:00 | High Aspect Ratio Carbon Mask Open for 3D NAND Memory Manufacture |
| Yang Li, AMEC | |
| 12:00-13:30 | Lunch Break |
Session V: BEOL Etching and Memory Etch
Session Chair: Shenjian Liu
| *13:30-14:00 | Memory Patterning Roadmaps |
| Siva Kanakasabapathy, Lam Research, US | |
| *14:00-14:30 | A High Performance Patterning Solution by Utilizing Combined Etching for Perpendicular STT-MRAM |
| Kaidong Xu, Leueven Instruments | |
| *14:30-15:00 | Advanced Selective Dry Etching of Silicon Based Materials and Cobalt |
| Jun Lin, TEL, Japan | |
| 15:00-15:15 | A Study on CD Variation Control of Advanced LELE MHM etch process in BEOL |
| Da Lin Yao, SMIC | |
| 15:15-15:30 | Coffee Break |
Session VI: ALE and Patterning
Session Chair: Jingrong Zhao (NMC)
| *15:30-16:00 | Benefits of atomic-level processing by Quasi-ALE and ALD technique |
| Masanobu Honda, TEL, Japan | |
| *16:00-16:30 | Major Challenges and Proposed Solutions for Critical Etch Applications with Inductive Coupled Plasma |
| Shenjian Liu, AMEC | |
| 16:30-16:45 | Study of very high selective downstream plasma etching mechanisms, for high aspect ratio patterns |
| Emilie PREVOST, STMicroelectronics and Laboratoire des Technologies de la Microélectronique | |
| 16:45-17:00 | Advanced Techniques for Enhanced Ion Beam Etch Uniformity |
| David Lishan, Plasma-Therm LLC | |
| 17:00-17:15 | A Novel Post Etch/Ashing Residue Remover for Copper Damascene Process |
| Sunny He, Anji Microelectronics (Shanghai) Co.,Ltd. |