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Dr. Takeshi Nogami is currently Principal Research Staff Member of IBM Research, IBM Corp. working in Albany, New York, USA on development of advanced BEOL process technology since he joined IBM in 2006. Prior to joining IBM, he worked for Toshiba Corp., Kawasaki Steel Corp., Advanced Micro Devices Inc., and Sony Corp.
His recent work includes CuMn alloy seed Low-k/Cu integration, CVD-Co wetting layer application to fine dimension BEOL, various diffusion barrier assessment for 10 nm and beyond, Cu/Co composite metallization, and advanced single damascene copper interconnection to extend Cu interconnect scheme. He received BE, ME, and Ph.D. in chemical engineering from University of Tokyo, Tokyo Japan. He is a Senior member of IEEE, IEEE IRDS BEOL chapter lead, SSDM committee member, Advanced Metallization Asian Session committee member. He is a holder of over 130 U.S. patents.
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