Grand Opening Keynote
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 Scan the QR code to enjoy Grand Opening Keynote live conference
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Date: Wednesday, March 17, 2021
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Time: 12:30-16:30
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Venue: Grand Shanghai Ballroom 1+2, Kerry Hotel Pudong, Shanghai
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 Chinese and English Simultaneous Interpretation will be provided
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Attendee Registration Previous Review
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The "Grand Opening Keynote" marks the start of SEMICON and FPD China. High-profile industry leaders will give keynote speeches, sharing insights on the global industry landscape, technology trend, and market. It is a golden opportunity to exchange ideas with the top global semiconductor industry leaders.
SPONSORS
Agenda 会议日程：
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12:30 – 13:00
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Registration 来宾登记
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13:00 – 13:35
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Opening Ceremony and Remarks 开幕典礼及致辞
Lung Chu
President, SEMI China; Vice President, SEMI
居龙，SEMI全球副总裁、中国区总裁
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Ajit Manocha (Video)
President & CEO, SEMI
Ajit Manocha, SEMI总裁兼首席执行官
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Government Official / Leader
政府及上海市领导
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Ning Wang
President, CECC
王宁，中国电子商会会长
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Bertrand Loy (Video)
Chairman, SEMI International Board; President and CEO, Entegris
Bertrand Loy, SEMI董事会主席、应特格微电子总裁兼首席执行官
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Zixue Zhou
Chairman, CSIA
周子学，中国半导体行业协会理事长
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13:35 –13:50
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Video Greeting 视频连线致辞
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Keynote Session
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Moderator主持人
Ganming Zhao
Vice President, General Manager Semiconductor China Account Applied Materials; Chief Technology Officer, Applied Materials China
赵甘鸣,
应用材料公司副总裁、半导体中国区事业部总经理;
应用材料中国公司首席技术官
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Keynote Speakers 主题演讲嘉宾
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13:50 – 14:15
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关于我国芯片制造的一些思考
Hanming Wu
Academician, Chinese Academy of Engineering; Dean, the School of Micro-nano-Electronics, Zhejiang University
吴汉明，中国工程院院士、浙江大学微纳电子学院院长
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14:15 – 14:40
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Shaping future of the mobility together
Thomas Manfred Müller
Executive Vice President, Volkswagen Group China Responsible for Research and Development
Thomas Manfred Müller，大众汽车集团（中国）执行副总裁兼董事、研发部负责人
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14:40 – 15:05
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Automotive Semiconductor Package & Test : Challenges & Opportunities
汽车半导体芯片封测 ：挑战与机遇
Li Zheng
Board Member, Chief Executive Officer, JCET
郑力, 长电科技首席执行官、董事
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15:05 – 15:20
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New Collaboration in the New Normal
Scott Meikle
Senior Vice President, Global Customer Operations, Lam Research
Scott Meikle，泛林集团全球客户运营高级副总裁
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15:20 – 15:45
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Advancing Electronics: Moore' s & More Materials -- Speed up the game in the fastest growing market
推进未来电子科技：摩尔定律与材料创“芯”—— 中国半导体市场的星辰大海
Allan Gabor
President, Merck China；Managing Director, Electronics China
Allan Gabor，默克中国总裁兼电子科技中国区董事总经理
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15:45 – 16:10
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Closing Keynote
Common Industry Challenge ： Imbalance between Supply and Demand
共同的行业挑战：供需失衡
Nanxiang Chen
Co-president, Unigroup
陈南翔，紫光集团联席总裁
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16:10 – 16:20
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VIP Conclusion Remarks 嘉宾特别总结致辞
Suxin Zhang
President, Shanghai Integrated Circuit Industry Association (SICA)
张素心，上海市集成电路行业协会会长
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Thank you 致谢结束
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* Agenda is subject to change 议程变化恕不另行通知
