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Monday, March 18, 2019 Shanghai International Convention Center
Meeting Room: 5B+5C
Session I:
Session Chairs: Huili Fu
| **13:30–14:00 | Heterogeneous Integration Roadmap Driving Force and Enabling Technology for Systems of the Future |
| Bill Chen, ASE | |
| Bill Bottoms, IEEE EPS | |
| *14:00-14:25 | High Performance Computing GPU and AI Packaging |
| Scott M and MC Hsieh, JCET | |
| *14:25–14:50 | Advanced Process Development for System-Like HD SiP |
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Mike Zhao, USI (A member of ASE Group) |
| *14:50–15:15 | Technology Development and Challenges of Power Packaging |
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Wayne Lin, TFME |
| 15:15–15:30 | Cavity substrate technology for SiP application with passive components |
| Ken Lee, Min Sung Kim, Jong Tae Lee, Dong Ju Jeon, Eun Ju Jang, Kyu Jin Lee, Simmtech | |
| 15:30–15:40 | Coffee Break |
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Session II:
Session Chair: Yifan Guo
| **15:40–16:10 | Redistribution-Layers for Fan-Out Wafer-Level Packaging and Heterogeneous Integrations |
| John H Lau, ASM | |
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*16:10–16:35 |
Development of 3D Embedded Silicon Integration Technology |
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Daquan Yu, HuaTian Technology |
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16:35–16:50 |
The plasma dry etching and surface-modification technologies for Fan-out |
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Daisuke Hironiwa, ULVAC Inc. |
| 16:50–17:05 | Studies of the influence of FOWLP dimensions on the flexure strength |
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Zhao-Wei Zhong, Nanyang Technological University |
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C. Xu, Nanyang Technological University, STATS ChipPAC Pte Ltd |
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W.-K. Choi, STATS ChipPAC Pte Ltd |
| 17:05–17:20 | Template Driven Graphene/Boron Nitride Nanostructure Incorporated Polymer Film for High Performance Thermal Interface Materials and EMI Applications |
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Kyoung-Sik (Jack) Moon, Georgia Institute of Technology |
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Tuesday, March 19, 2019 Shanghai International Convention Center
Meeting Room: 5B+5C
Session III:
Session Chair: Frank Koo
| *8:30–8:55 | Advance MIS Technology Development |
| Eric Zhu, JCET | |
| *8:55–9:20 | Wafer Level Packaging - A mid-end approach |
| Liu Hong Jun, China Wafer Level CSP Co., Ltd | |
| 9:20–9:35 | World's First 5G mm-Wave Ultra-Wideband Dual Polarization Antenna Using Stackable Packaging - SmartPoser™ |
| Cheng Chung Lin, Cheng Tar Wu, Yen Heng Chen, Dirk Zhou, Jiao Lv, Yuedong Qiu, Leslie Huang, Johnson Lin, SJ Semiconductor (JiangYin) Corp | |
| ZhanYi Qian, Bin Yu, Speed Wireless Technology Co., Ltd. | |
| 9:35–9:50 | Advanced Semiconductor Packaging Materials-Copper with Bamboo Structure |
| Jing Wang, Peipei Dong, Xingxing Zhang, Yun Zhang, Suzhou Shinhao Material LLC. | |
| 9:50–10:05 | Advanced Multifunctional Temporary Bonding Materials with Heterogeneous Integrated Properties for Various Advanced Packaging Applications |
| Xiao Liu, Dongshun Bai, Lisa Kirchner, Rama Puligadda, Tony Flaim, Brewer Science Inc. | |
| 10:05–10:20 | Delamination Improvement for a QFN Package With Stacked Dies by Finite Element Simulation |
| Weidong Huang, Jian Jin, April Yang, Wei Wu, Jacky Wu, Grass Dong, CF Oo, Diodes Shanghai Co., LTD. | |
| 10:20–10:30 | Coffee Break |
Session IV:
Session Chairs: Mark Huang
| *10:30–10:55 | Analysis Methods for High Purity Sputtering Target Materils |
| Xueze Wang, KFMI | |
| *10:55–11:20 | High Thermal Conductive DA Development |
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Tim Chen, Yantai Darbond Technology Co., Ltd. |
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| 11:20–11:35 |
Permanent Bonding Process Development Using Gapless Glue for CIS-TSV Wafer Level Packaging |
| Chengqian Wang, Yi Liu, Meng Zhang, Shuying Ma, Zhiyi Xiao, Daquan Yu, HuaTian Technology (Kunshan) Electronics Co., Ltd. | |
| 11:35–13:00 | Lunch Break |
Session V:
Session Chairs: Xing Wu
| *13:00–13:25 | SCR Devices with Embedded RC triggering structure for ESD Protection |
| Zhiwei Liu, University of Electronic Science and Technology | |
| *13:25–13:50 | High -resolution Time-domain Reflectometry Analysis in Back-End-Of-Line (BEOL) by Recursive Circuit Modeling |
| Dr. Yang Shang, Advantest | |
| 13:50–14:05 | High Density Interconnects: Migrating from Concept to Mainstream |
| Brandon Prior, Prismark | |
| 14:05–14:20 | Finite element analysis of high power press-pack insulated gate bipolar transistors packaging model |
| Zhao Wang, Ke Feng , Xiaofei Yang , Xiaoli Wang, Baozi Wang, CRRC Yongji Electric Co., Ltd. | |
| 14:20–14:35 | Optimal Design of Heat Dissipation Structure of IGBT Modules Based on Graphene |
| Hao Zhao, Huangshan University, Huangshan Bonnie Two-Dimensional New Material Technology Co., Ltd. | |
| Jie Bao, Yuan Xu, Huangshan University | |
| Wenyi Xu, Huangshan Bonnie Two-Dimensional New Material Technology Co., Ltd. | |
| 14:35–14:45 | Coffee Break |
Session VI:
Session Chair: Wenhui Zhu
| *14:45-15:10 | Substrate Based PLP Technology |
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Lingwen Kong, Shennan Circuits Company Limited (SCC) |
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| *15:10-15:35 | Advanced Packaging and the Materials Challenges |
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Fay Hua, Ningbo S J Electronics Co. Ltd |
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| 15:35-15:50 | Wafer Thinning and Dicing Technology for 3D NAND Flash |
| Qian Ma, Jiantao Lin, Hao Liu, Ramaxel Technology Co, Ltd. | |
| Jeroen van Borkulo, ASM Laser Separation International | |
| 15:50-16:05 | Low Temperature Stretchable Bonding Technology Applicable to Flexible Substrates |
| Katsunori Maeda, Hiroshi Komatsu, Nozomi Shimoishizaka, CONNECTEC JAPAN Corporation | |
| 16:05-16:20 | Chemistry Solutions for Enhanced Reliability of Sub 5 µm L/S RDL for 5G |
| Daniel Schmidt, Atotech Group | |
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| Poster Session: | Location: 5th Floor |
| Coffee Break | A small "dead-area" packaging approach for conventional front side illuminated photodetectors |
| Wenxuan Cheng, Ru Yang, Jian Liu, Xingan Zhang, Ran He, Kun Liang, Dejun Han, Beijing Normal University | |
| Design method of multi-neutral layer structures: Their application to flexible electronics | |
| Zujun Peng, Ying Chen, Xue Feng, Tsinghua University | |
| Volume Resistivity of Epoxy Molding Compound | |
| Hongjie Liu, Wei Tan, Xingming Cheng, Yangyang Duan, Xin Xiao, Lanxia Li, JiangSu HHCK Advanced materials Co., Ltd. | |
| Zhen Wang, Jiangsu Union Technical Institute |