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Will Conley joined Cymer (an ASML company) in 2012. He is currently in the Applications Engineering Team focused on leading edge node imaging and integration issues. Prior to Cymer, Mr. Conley was in the DfM team at Freescale in Austin, Texas where he is focused on “next node” activities. He has done assignments at the IBM Alliance in NY working on post OPC verification for 28 and 20nm and at the Crolles 2 Alliance for Freescale developing processes for the 45nm and 32nn nodes. He holds 24 patents and has published over 140 papers in the area of lithographic materials and processes. He is the former chair of the SPIE Advanced Lithography Conference on Resist Technology (1998, 1999) and the former Chair of the SPIE Advanced Lithography Conference on Optical Lithography (2012, 2013) and the current Co-Chair of the 2017 SPIE Conference on Advanced Lithography. He was awarded the Maboob Kahn Outstanding Industry Liaison by the SRC (Semiconductor Research Corporation) in 2003 and 2009. Mr Conley was elected a Fellow of Society of Photo-Optical Instrumentation Engineers (SPIE) in February of 2008.
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