(** to designate keynote talk, * to designate invite talk)
Sunday, March 11, 2018 Shanghai International Convention Center
Meeting Room: 5B+5C
Session I:
Session Chair: Dr. Huili Fu
| 13:30-13:35 | Opening Remarks |
| Dr. Steve X. Liang, JCET | |
| **13:35-14:05 | FAN-OUT WAFER-LEVEL PACKAGING FOR 3D IC HETEROGENEOUS INTEGRATION |
| John H Lau, ASM Pacific Technology | |
| **14:05-14:35 | Packaging and Integration Strategy for mmWave Products |
| SW Yoon, JCET/STATSChipPAC | |
| **14:35-15:05 | New Wave SiP for mmWave |
| Dr. KK Kuo, Senior Director, Engineering Center, ASE | |
| *15:05-15:30 | Driving into the Innovation World – Amkor’s Automotive Package Solution |
| John Lee, Amkor | |
| 15:30-16:15 | Coffee Break |
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Session II:
Session Chair: Dr. Yifan Guo
| *16:15-16:40 | Improvement of Package Warpage through Substrate and EMC Optimization | ||
| Ken Lee, Simmtech, Co., Ltd. | |||
| *16:40-17:00 | Emerging fine line panel level fan out technology | ||
| David Fang, PTI | |||
| *17:00-17:20 | Process Development of five- and six-side (5s/6s) molded WLCSP | ||
| Shuying Ma, Huantian Technology (Kunshan) Electronics Co., Ltd. | |||
| *17:20-17:40 | The Signal Integrity Study of SIP Package Using TSV Interposer | ||
| Peng Sun, National Center for Advanced Packaging | |||
| *17:40-18:00 | Effective EMI Shielding for Semiconductor Packages through Novel Conformal Coating Solutions | ||
| Qizhuo Zhuo, Henkel Electronic Materials | |||
| Poster Session: | Location: 5th Floor | ||
| Coffee Break | Method to reduce metal filament on die with backside metal | ||
| Bo Peng, NXP semiconductor | |||
| Effects of Encapsulation Glue and Bonding Wire on the Strength of Smart Card Modules | |||
| Hongtao Gao, Shanghai Eternal Information Technology Company | |||
| silane oligomer in epoxy molding compound | |||
| Hongjie Liu, Jiangsu HuaHaiChengKe Advanced Materials Co. Ltd. | |||
| Safeseal for the Plating application | |||
| Zhipeng Huang, AMAT | |||
Monday, March 12, 2018 Shanghai International Convention Center
Meeting Room: 5B+5C
Session III:
Session Chair: Prof. Kuan-Neng Chen
| **8:30-8:55 | New Developments in Advanced MIS Packaging |
| YB Lin, JCET | |
| *8:55-9:20 | Polyimide applications and development in advanced packaging |
| Shian Shen, Taiflex Scientific (/NCTU) | |
| 9:20-9:35 | Latest developments of molding compound material for power semiconductors |
| Yusuke Tanaka, Sumitomo Bakelite (Suzhou) Co., Ltd. | |
| 9:35-9:50 | Thermal and Mechanical Performance for Different Package Design of Ultra Thin 8 Die Stacked Flash BGA Packages |
| Hao Liu, Ramaxel | |
| 9:50-10:05 | Wafer warpage control by epoxy molding compounds for wafer level package |
| Ki Hyeok Kwon, Samsung SDI | |
| 10:05-10:40 | Coffee Break |
Session IV:
Session Chair: Dr. Mark Huang
| *10:40-11:05 | Advanced Panel Level Die Attach |
| Hugo Pristauz, Besi Austria GmbH | |
| 11:05-11:20 | Laser Release Technology for Wafer Level Packaging |
| Dongshun Bai, Brewer Science, Inc. | |
| 11:20-11:35 | Capillary Wedge Bonding Technology for Stacked Die Packages |
| Hao Liu, Ramaxel | |
| 11:35-11:50 | Study On The High Reliability Performance And High Thermal Conductivity Epoxy Molding Compound |
| Wei Tan, Jiangsu HuaHaiChengKe Advanced Materials Co. Ltd. | |
| 11:50-12:05 | Highly Functionalized EMC Package Materials for Fingerprint Sensors |
| Jun Woo Lee, Samsung SDI | |
| 12:05-13:40 | Lunch Break |
Session V:
Session Chair: Dr. Shin-Puu Jeng
| *13:40-14:00 | STRUCTURING REDISTRIBUTION LAYERS DOWN TO 2 MICRON LINE SPACING WITH LASER DIRECT ABLATION |
| Dirk Müller, Coherent | |
| *14:00-14:15 | TBD |
| Fan Chun Ho, ASM Pacific | |
| 14:15-14:30 | New Application Method for Package Level EMI Shield Coating |
| Stuart Erickson, Ultrasonic Systems, Inc. | |
| 14:30-14:45 | Thin Die Stacking Technologies for 3D Memory Packages |
| Wu Jie, Kulicke & Soffa Pte. Ltd. | |
| 14:45-15:00 | Electroplated Nanotwin Copper for Fine Line RDL |
| Stream Chung, Chemleader Corporation |
Session VI:
Session Chair:
| 15:00-15:15 | Low Temperature Flip-Chip Technology for Flexible Hybrid Electronics |
| Katsumori Maeda, CONNECTEC JAPAN Corporation |