(** to designate keynote talk, * to designate invite talk)
Sunday, March 12, 2017 Shanghai International Convention Center
Meeting Room: 5A
Session I: CMP fundamentals and Manufacturing
Session Chair: Yuchun Wang
| **13:30-14:00 | Innovations by Serendipity |
| Manabu Tsujimura, Ebara | |
| *14:00-14:25 | Replacement Metal Gate (RMG) CMP for 14nm Transistor Scaling: Overview, Challenges and Opportunities |
| Hong Jin Kim, Globalfoundries | |
| *14:25-14:50 | Nano Scale Interface Control for 28nm Cu CMP through Cu/Barrier Slurries |
| Zhijie Zhang, Semiconductor Manufacturing North China (Beijing) Corp. | |
| 14:50-15:15 | Model of Defect Forming During Post Cleaning of W CMP and Its Improving Solution |
| Zigui Cao, Huahong Grace Semiconductor Manufacturing Corporation | |
| 15:15-15:30 | Coffee Break |
Session II: CMP Particle Technology
Session Chair: David Huang
| *15:30-15:55 | Abrasive Particle Trajectories and Material Removal Non-uniformity during Chemical Mechanical Polishing |
| Prof. S.V. Babu, Clarkson University | |
| *15:55-16:20 | Application of Particle/Aerosol Technology to CMP Process Analysis |
| Taesung Kim, Sungkyunkwan University | |
| *16:20-16:45 | CMP slurry metrology to meet the industry demand |
| Rashid Mavliev, Ipgrip Inc | |
| Poster Session: | Location: Foyer of Yangtze River Hall |
| Coffee Break | Development of a Standard Evaluation System to Characterize and Quantify Pad Foam Morphology in Chemical Mechanical Polishing (CMP) |
| ZHICHAO LI, North Carolina Agricultural & Technical State University | |
| An Overview of Geometric Design for Diamond Disc Conditioner in Chemical Mechanical Planarization (CMP) | |
| ZHICHAO LI, North Carolina Agricultural & Technical State University | |
| A Systematic Study on Processing Specifications for Manufacturing Sapphire Wafers | |
| ZHICHAO LI, North Carolina Agricultural & Technical State University | |
| Application of in-situ profile control by Fullvision in Oxide CMP | |
| Changxing Tan, Applied Materials China | |
| Optimization of Slurry and Process Parameter on Chemical Mechanical Polishing of Cr-doped Sb2Te3 Film | |
| Ruifang Huo, Tianjin University of Technology | |
| STUDY OF WEAKLY ALKALINE SLURRY FOR COPPER BARRIER CMP ON MANUFACTURE PLATFORM | |
| Jin Kang, SMIC |
Monday, March 13, 2017 Shanghai International Convention Center
Meeting Room: 5A
Session III: Advanced CMP Process
Session Chair: KC Wu
| *8:30-8:55 | Challenges in CMP Defects of 7nm Device and its improvement opportunities |
| Dr. Ji Chul Yang, Globalfoundries | |
| 8:55-9:10 | SiOC CMP Developed and Implemented in 7nm and Beyond |
| Huang Haigou, Globalfoundries | |
| *9:10-9:35 | Impact of Wafer Transfer Process on STI CMP Scratches |
| Fan Bai, Semiconductor Manufacturing North China (Beijing) Corp. | |
| 9:35-9:50 | Research and solution of STI CMP dishing and uniformity improve for 28LP |
| Zhang Lei, Shanghai Huali Microelectronics Corporation | |
| 9:50-10:05 | Coffee Break |
Session IV: CMP consumables
Session Chair: Johnson Lin
| *10:05-10:30 | A New Acidic ILD Slurry Formulation for Advanced CMP |
| Yi Guo, Dow Electronic Materials | |
| 10:30-10:45 | Settling of Colloidal Silica Particles in CMP Slurry:Monitoring, Effect, and Handling |
| Jie Lin, Fujimi Corporation | |
| *10:45-11:10 | SiN Slurry with high selectivity |
| Wenting Zhou, Anji Microelectronics (Shanghai) Co., Ltd. | |
| 11:10-12:50 | Lunch Break |
Session V: New CMP Applications and Equipment
Session Chair: Xinchun Lu
| *12:50-13:15 | Outsourced CMP for Rapid Development and Efficient Manufacturing |
| Robert L. Rhoades, Entrepix, Inc. | |
| *13:15-13:40 | Chemical Mechanical Planarization – Building Stacked Devices |
| Viorel Balan, Univ. Grenoble Alpes | |
| *13:40-14:05 | Cu CMP Dishing and Erosion Optimization for Hybrid Bonding Technology |
| GuangYi Wang, Wuhan Xinxin Semiconductor Manufacturing Co., Anji Microelectronics | |
| *14:05-14:30 | Study of Electro-Kinetic Force Assisted Chemical Mechanical Polishing for Through-Silicon-Via Wafer Planarization |
| CHAO-CHANG CHEN, National Taiwan University of Science and Technology | |
| 14:30-14:45 | Process Stability and Tool capacity Improvement with 150mm profiler and 200mm Contour Heads |
| Yanghua He, Qorvo, Inc | |
| 14:45-15:00 | Coffee Break |
Session VI: TBD
Session chair: TBD
| 15:00 | TBD |
| TBD |