Dr. Lei Guo

Senior Engineer, General Manager of the CMP BU
Hwatsing, China

Lei Guo, Ph.D. from Tsinghua University, Senior Engineer, currently General Manager of the CMP BU at Hwatsing. He has long been engaged in the R&D of high-speed precision semiconductor equipment. He led the development of China's first wafer edge polishing equipment and Panel CMP equipment. His research also covers ECMP as well as CMP technology for ultra-hard materials including SiC. Focusing on polishing equipment, consumables and processes, he has presided over and participated in multiple government-funded research projects.