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Sunday, March 14, 2021 Shanghai International Convention Center
Meeting Room: 5B+5C
Session I: 3D and Advanced Packaging Technologies
Session Chair: Renzhe Zhao
| *13:30–13:55 | TSV and Hybrid Bonding Solutions for 3D Heterogeneous Integration Packaging Applying in next AI / HPC Era |
| Albert Lan, Applied Materials | |
| *13:55-14:20 | The Development of 3D IPDs on Glass Wafer |
| Daquan Yu, Xiamen University | |
| 14:20–14:35 | Research on the Improvement of SI Performance of High Bandwidth Memory Interface by New 2.5D Silicon Interposer Structure |
| Chen Xiaolang, Sanechips Technology Co.,Ltd. | |
| 14:35–14:50 | Innovative PVD Technology Solutions for Advanced Substrate, Backside Metal and EMI Shielding |
| Jeff Turner, Applied Materials | |
| 14:50–15:05 | Next Generation High Performance, Six-pack Double Side Cooled IGBT Power Module for EV/HEV Applications |
| Yaqing Ma, Zhuzhou CrrcTimes Electric UK Innovation Center | |
| 15:05–15:25 | Coffee Break |
Session II: Packaging Equipment and Process
Session Chair: Renzhe Zhao
| *15:25–15:50 | Opportunities and Challenges of Wet Process Tools for Wafer Level Package Mmanufacturing Driven by 3D Technology |
| David Wang, ACM | |
| 15:50–16:05 | Important Considerations of Selecting Wafer/Panel-level Die Pick & Place Tool For High Volume Manufacturing |
| Nelson Fan, ASM Pacific Technology Ltd. | |
| 16:05–16:20 | Ashing Process on Warpage Wafer with Low Damage |
| Zihan Dong, NAURA, Beijing | |
| 16:20–16:35 | Numerical Study on the Effect of Graphene Sheet Alignment on Thermal Conductance of Graphene Form |
| Yan Zhang, Shanghai University | |
Monday, March 15, 2021 Shanghai International Convention Center
Meeting Room: 5B+5C
Session III: Advanced Packaging Process
Session Chair: Xing Wu
| *08:45-09:10 | Challenges and Oppotunities of Wide Bandgap Power Devices Packaging & Integration Technology |
| Laili Wang, School of Electronical Engineering, Xi'an Jiaotong University | |
| 09:10-09:25 | TTV Controlling and Optimization Technology for Wafer Ultra-precision Grinding Thinning Process |
| Yuanhang Liu, Tsinghua University | |
| 09:25–09:40 | Conformal Coating Process Optimization for Limiting Bubbles Formation |
| Rexel Macaraya, Integrated Micro-Electronics Inc. | |
| 09:40–09:55 | Electrochemical Migration (ECM) Prevention in Gate to Source of MOSFETs of Insulated Metal Substrate PCB Assembly |
| Rexel Macaraya, Integrated Micro-Electronics Inc. | |
| 09:55–10:15 | Coffee Break |
Session IV: Inspection, Test and Reliable
Session Chair: Xing Wu
| *10:15-10:40 | Bonding and Inspection Solution for Advanced IC Packaging |
| Chien Kuo, LiZhu Semiconductor | |
| *10:40-11:05 | New Frontier in Advanced Packaging Inspection Systems |
| Song Zhang, SKYVERSE | |
| *11:05-11:30 | Active temperature Control Technology Solution for Emerging Tri-temp Test Applications |
| Xiao Han, Hangzhou Changzhuan Technology | |
| 11:30-11:45 | First Pass Yield Gain Strategies during Tri-Temperature Automotive Package Test |
| Jerry Broz, International Test Solutions | |
| 11:45-12:00 | Research on the Thermal Reliability of Multi-unit PIM |
| Juan Hu, Huangshan University | |
| 12:00-13:30 | Lunch Break |
Session V: Noval Packaging Materials and Process
Session Chair: Daquan Yu
| *13:30–13:55 | Temporary Bonding/Debonding Materials for Advanced Packaging |
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Guoping Zhang, Shenzhen Institute of Advanced Electronics Materials |
| 13:55–14:10 | A Study Of Thermal Interface Materials With Different Thermal Conductivity For HFCBGA Package |
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Feng Wang, ZTE Corporation |
| 14:10–14:25 | A Novel Multifunctional Single-Layer Adhesive Used for both Temporary Bonding and Mechanical Debonding in Wafer-Level Packaging Applications |
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Wenkai Cheng, Brewer Science, Inc |
| 14:25–14:45 | Coffee Break |
| Poster Session: | Location: 5th Floor |
| Coffee Break | Research on the design and fabrication of aluminum nitride microwave multilayer ceramic package |
| Zhen-tao Yang, The 13th Research Institute, China Electronics Technology Group Corporation | |
| A Micro Soldering Method to Improve Strength Between Bonding Pad and Wire | |
| Li He, Microsystem & Terahertz Research Center, China Academy of Engineering Physics (CAEP) | |
| Effect of Bi content on the microstructure and mechanical properties of Cu/Sn-Bi/Cu solder joints after soldering and aging | |
| Mingliang Huang, Dalian University of Technology | |
| The effect of resin type on the performance of epoxy molding compound | |
| Hongjie Liu, Jiangsu HHCK advanced materials Co., Ltd. | |
| Research on Lap Welding manner of Laser Seal Welding Technology of the Common Microwave Module Package Materials | |
| Na Li, The 13th Research Institute, China Electronics Technology Group Corporation |