| ** | to designate keynote talk - 30 min | Sponsored by: |
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| * | to designate invite talk - 25 min | ||||||
| to designate regular talk - 15 min |
Sunday, March 14, 2021 Shanghai International Convention Center
Meeting Room:
Session I: Lithograpy/Etch joint session
Session Chairs: Leo Pang (D2S) / Ying Zhang (Naura)
| 13:30-13:35 | Opening |
| **13:35-14:05 | The latest development and results in advanced technoogy nodes patterning |
| Rich Wise, Lam Research | |
| **14:05-14:35 | 2-D Logic Device Scaling to Forksheet, and technical challenges to Nanosheet / Forksheet configurations |
| David Xiao, IMEC | |
| **14:35-15:05 | Advanced Packaging Architectures for Advanced Heterogeneous Integration (HI) |
| Ravi Mahajan, Intel | |
| 15:05-15:30 | Coffee Break |
Session II: Lithography Materials
Session Chair: Zhimin Zhu (Intel) / Xiaoming (Dow)
| *15:30-15:55 | Negative-tone imaging (NTI) for advanced lithography with EUV exposure to improve 'Chemical Stochastic' |
| TORU FUJIMORI, FUJIFILM Corporation | |
| 15:55-16:10 | Advanced Lithography Material Status toward 5nm Node and Beyond |
| Koichi FUJIWARA, JSR Shanghai Co., Ltd. | |
| *16:10-16:35 | Progress and outlook towards High-NA EUV materials |
| Jara Garcia Santaclara, ASML | |
| 16:35-16:50 | High Performance Filtration for Bulk and POU filtration of EUV |
| Lucia D’Urzo, Pall | |
| 16:50-17:05 | Development of planarizing spin-on carbon material for high-temperature processes |
| Runhui Huang, Brewer Science Inc. | |
Monday, March 15, 2021 Shanghai International Convention Center
Meeting Room:
Session III: Process and Simulation
Session Chair: Yuyang Sun (Mentor) /Da Yang (TEL)
| *8:30-8:55 | Contour based process characterization, control and hotspot prediction for semiconductor manufacturing |
| AO CHEN, Mentor, a Siemens Business | |
| 8:55-9:10 | Lithographic Simulator Based on Deep Learning with Graph Input |
| Peng Xu, IMECAS | |
| 9:10-9:25 | The Setting of Linewidth Reference on Photomask through Physical Process Modeling |
| Rui Hu, Shanghai IC R&D Center | |
| 9:25-9:40 | SEM Image Transformation between Litho Domain and Etch Domain |
| Yan Yan,Shanghai IC R&D Center | |
| *9:40-10:05 | ML enhanced full-flow design guided wafer defect analysis and reduction |
| Qian Xie, Mentor, a Siemens Business | |
| 10:05-10:20 | Coffee Break |
Session IV: Computational Lithography
Session Chair: Ken Wu (ICRD) /Yayi Wei (IME)
| *10:20-10:45 | Full Chip Curvilinear ILT with both Multi-Beam and VSB Mask Writers That Doubles Wafer Process Windows |
| Leo Pang, D2S | |
| *10:45-11:10 | Optical Proximity Correction (OPC), Methodology and Limitations |
| Yongqiang Hou, Shanghai IC R&D Center | |
| 11:10-11:25 | Source and mask optimization with narrow-band semi-implicit scheme |
| Yijang Shen, Guangdong University of Technology | |
| *11:25-11:50 | Simulation investigation of resolution enhancement techniques (RETs) for EUV single patterning of logic Via layers in 5nm node |
| Boer Zhu, ASML | |
| 11:50-13:30 | Lunch Break |
Session V: Next Generation Lithography
Session Chair: Wei-Min Gao (ASML) / Imai-san (Mitokogyo)
| **13:30-14:00 | Update of >300W High Power LPP-EUV Source Challenge III for Semiconductor HVM |
| Hakaru Mizoguchi, Gigaphoton | |
| *14:00-14:25 | 193i lithography’s path to the future |
| Stephen Renwick, Nikon Research Corp of America | |
| *14:25-14:50 | Nanoimprint Performance Improvements for High Volume Semiconductor Manufacturing |
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Keita Sakai, Canon Inc. |
| *14:50-15:15 | Extending the capability of lithography with mechanical processesthan 20nm width materials |
| Huigao Duan, Hunan University | |
| *15:15-15:30 | Coffee Break |
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Session VI: mask, inspection, overlay, and metrology equipment
Session Chair: Shiyuan Liu )HUST) / Chris Progler (Photronics)
| *15:30-15:55 | A New Generation Cost-efficient Laser Mask Writer for Mature Semiconductor Nodes |
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Peter Henriksson, Mycronic AB |
| *15:55-16:20 | An innovative graphical platform for real time accurate AEI overlay prediction and rework control |
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Yaobin FENG, YMTC |
| *16:20-16:45 | Feed-forward correction of on-product overlay using standalone alignment technology |
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Masahiko OKUMURA, Nikon Corporation |
| *16:45-17:10 | Integrated optical metrology solutions for advanced IC fabrication |
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Jonee Li, Shanghai Precision Measurement Semiconductor Technology,Inc. |
| *17:10-17:35 | Overlay metrology based on Mueller matrix scatterometry |
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Hao Jiang, Huazhong University of Science and Technology |
| *17:35-18:00 | Reference Metrology Using 3D-PSD of Post-Etch LWR |
| Masami Ikota, Hitachi High-Tech Corp. | |
| Poster Session: | |
| Critical Dimension Uniformity Improvement of Negative Toned Developing Process for Hole Type Pattern | |
| Rui-Lin Zhang, Semiconductor Manufacturing International Corporation | |
| The photoresist developing ability study at different contact angle and mask transmission rate | |
| Chen Lijun, Shanghai Huali Microelectronics Corporation | |
| The Mechanism Study of Rounded AA Damage Defect after POLY Loop | |
| Zheng Haichang, Shanghai Huali Microelectronics Corporation | |
| Improving Scanner Alignment Accuracy by Wafer Alignment Optimization | |
| Ma Yuanzhao, Nikon Precision Shanghai | |
| Contour extraction for SEM image based on deep learning method | |
| Li Chen, Shanghai IC R&D Center | |
| Extreme edge uniformity control study in Poly-Si Planarization etch | |
| Minxiang Wang, Lam Research Service Co., Ltd | |
| Aberration analysis and control based on fully connected neural network | |
| Shuang Zhang, Shanghai IC R&D Center | |
| Mining Lithography Hotspots from Massive SEM Images Using Machine Learning Model | |
| Zhou Tao, Shanghai IC R&D Center | |
| MIX AND MATCH OVERLAY IMPROVEMENT STUDY ON NIKON IMMERSION SCANNER | |
| Ma Yuanzhao, Nikon Precision Shanghai | |